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 Conference Papers (Available on Advance Programs)  (Sort by: Date Descending)
 Results 41 - 53 of 53 [Previous]  /   
Committee Date Time Place Paper Title / Authors Abstract Paper #
AP, MW
(Joint)
2011-03-04
10:20
Ibaraki Ibaraki Univ. Study on diamond thin film semiconducting devices for application to a development of hard-electronics high frequency driving circuit
Jeong-Gab Ju, Young-Bae Park, Bo-Ra Jung, Jang-Hyeon Jeong, Eui-Hoon Jang, Suk-Youb Kang, Young Yun (Korea Maritime Univ.) MW2010-166
In this paper, basic electrical properties of semiconducting diamond were investigated in order to check its capability ... [more] MW2010-166
pp.83-85
NC, NLP 2011-01-25
15:35
Hokkaido Hokakido Univ. [Invited Talk] Neuromorphic Microelectronics -- From Devices to Hardware Systems and Applications --
Alexandre Schmid (Swiss Federal Inst. of Tech. EPFL) NLP2010-152 NC2010-116
The development of Neuromorphic micrcoelectronic systems has followed the advances in computational biology as well as p... [more] NLP2010-152 NC2010-116
pp.159-164
OFT 2010-10-25
14:25
Saitama Nippon Institute of Technology Development and transmission quality estimation of a new optical frequency resource of the T-band for ultra-broadband holey-fiber photonic transport system
Yu Omigawa, Yuta Kinoshita, Kazuyuki Yamamoto (Aoyama Gakuin Univ.), Naokatsu Yamamoto, Atsushi Kanno, Kouichi Akahane, Tetsuya Kawanishi (NICT), Hideyuki Sotobayashi (Aoyama Gakuin Univ.) OFT2010-33
To expand the usable wavelength bandwidth for optical communications, we have focused on a use of a 1-micrometer wavelen... [more] OFT2010-33
pp.25-28
ED, SDM 2010-07-02
16:15
Tokyo Tokyo Inst. of Tech. Ookayama Campus Study on Collective Electron Motion in Si-Nano Dot Floating Gate MOS Capacitor
Masakazu Muraguchi (Tohoku Univ.), Yoko Sakurai, Yukihiro Takada, Shintaro Nomura, Kenji Shiraishi (Univ. of Tsukuba.), Mitsuhisa Ikeda, Katsunori Makihara, Seiichi Miyazaki (Hiroshima Univ.), Yasuteru Shigeta (Univ. of Hyogo), Tetsuo Endoh (Tohoku Univ.) ED2010-122 SDM2010-123
The efficiency and stability of electron injection from the electrode to the nano-structure is one of the most important... [more] ED2010-122 SDM2010-123
pp.319-324
EMCJ 2008-12-19
13:25
Gifu Gifu Univ. [Special Talk] EMC Surroundings and Evaluation of Automotive Electronic Components
Michihira Iida, Masato Izumichi (DENSO CORPORATION) EMCJ2008-94
The number of electronics components are increasing, realizing the recent demand for cars, such as IT (Information Techn... [more] EMCJ2008-94
pp.45-50
EMD 2008-11-15
11:00
Miyagi Tohoku Bunka Gakuin University (Sendai) Improvement in parameters of older construction power contactors by modernization of their drivers
Piotr Borkowski, Grzegorz Drygala (Tech. Univ. of Lodz) EMD2008-70
In practice there are cases when electrical apparatuses available on the market do not fully comply with requirements st... [more] EMD2008-70
pp.21-24
ED 2008-08-04
16:10
Shizuoka Sizuoka Univ. Hamamatsu Campus Report of the Ninth IEEE International Vacuum Elecronics Conference(IVE2008)
Takao Kageyama (FAIS) ED2008-116
This paper reports recent R&D activities on Vacuum Electronics including design, component and production technologies. ... [more] ED2008-116
pp.35-38
OPE, LQE 2008-06-27
15:25
Tokyo Kikai-Shinko-Kaikan Bldg [Invited Talk] Report on CLEO2008
Tetsuya Kawanishi (NICT) OPE2008-26 LQE2008-27
This paper reports on CLEO 2008 held at San Jose Convention Center, CA, USA, from 4th to 9th May. We focus on technical ... [more] OPE2008-26 LQE2008-27
pp.39-42
ET 2008-03-08
14:05
Tokushima Tokushima Univ. Hands-on study based on self-organizing activities of electronics-circuit building
Mariko Yao, Junichi Akita (Kanazawa Univ.) ET2007-91
Recently, the students in electronic engineering courses are expected to acquire expert knowledge as well as nurture cre... [more] ET2007-91
pp.41-46
CPM, ICD 2008-01-18
16:10
Tokyo Kikai-Shinko-Kaikan Bldg Reliability evaluation of lead free solder joint against vibration load under thermal circumstance
Michiya Matsushima (Osaka Univ.), Toshiyuki Hamano (ESPEC), Kiyokazu Yasuda, Kozo Fujimoto (Osaka Univ.) CPM2007-148 ICD2007-159
The reliability of electronics solder joints is evaluated for each individual stress even if the electronics devices are... [more] CPM2007-148 ICD2007-159
pp.117-122
MoNA, IN
(Joint)
2007-11-15
16:30
Fukuoka Fukuoka Institute of Technology [Invited Talk] Invited Talk
Motoharu Miyake, Takashi Yoshikawa, Masaharu Nakatsuchi, Atsushi Takeshita (NTT DoCoMo) IN2007-93 MoMuC2007-56
Specifications for sharing digital content (images, music and video) using consumer electronics, personal computers and ... [more] IN2007-93 MoMuC2007-56
pp.25-30(IN), pp.1-6(MoMuC)
ED, SDM 2007-06-25
13:00
Overseas Commodore Hotel Gyeongju Chosun, Gyeongju, Korea [Keynote Address] Aspect of SiC R&D in Japan
Kazuo Arai (AIST)
SiC power devices is expecting to be industrialized as soon as possible in view of energy saving. In this presentation t... [more]
ED 2006-08-03
16:30
Osaka Osaka Univ. Convention Center TFT-controlled FED
Masayoshi Nagao, Chiaki Yasumuro, Yuuichi Sakamura, Seigo Kanemaru, Junji Itoh (AIST)
Thin-film transistor-controlled field-emission display (TFT-controlled FED) was fabricated. Each pixel of the FED has fi... [more] ED2006-126
pp.47-52
 Results 41 - 53 of 53 [Previous]  /   
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