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All Technical Committee Conferences (Searched in: All Years)
| Committee | Date Time | Place | Paper Title / Authors | Abstract | Paper # | |
| EMD, CPM, OME | 2016-06-17 16:20 |
Tokyo | Kikai-Shinko-Kaikan Bldg. | Magnetic Pulse Welding of Copper Foils on Rigid and Flexible Printed Circuit Boards (2nd Report) Tomokatsu Aizawa (Tokyo Metropolitan College), Yoshitaka Sugiyama (Yazaki)  EMD2016-15 CPM2016-22 OME2016-25 |
This paper describes a novel welding technique for overlapped copper foils of rigid and flexible printed circuit boards.... [more] | EMD2016-15 CPM2016-22 OME2016-25 pp.39-42 |
| EMD | 2016-05-20 14:50 |
Hokkaido | Chitose Arcadia Plaza | Influence of electrical contact material on breaking characteristics of arc discharge at DC high voltage
-- Experimental results from DC200 to 500V of various materials -- Kiyoshi Yoshida, Koichiro Sawa, Hikaru Kanou, Hiroto Yamagishi (NIT), Kenji Suzuki, Koetsu Takaya (Fuji FA Comp.& Sys.) EMD2016-4 |
The experimental apparatus that is able to set opening velocity at wide-range of 1-200mm/s with an equal speed was used ... [more] | EMD2016-4 pp.19-24 |
| SDM | 2016-01-22 11:35 |
Tokyo | Sanjo Conference Hall, The University of Tokyo | In-situ ellipsometry of Cu surfaces immersed in BTA-H2O2 solutions Tatsuya Kawakami, Eiichi Kondoh, Mitsuhiro Watanabe (University of Yamanashi), Satomi Hamada, Shohei Shima, Hirokuni Hiyama (Ebara Corporation) SDM2015-111 |
During Cu CMP, Cu surface is oxidized by an oxidizer or a complexiation reagent. To inhibit oxidation, a corrosion inhib... [more] | SDM2015-111 pp.13-15 |
| CPM | 2015-11-06 13:20 |
Niigata | Machinaka Campus Nagaoka | Preparation of Cu halide transparent thin film by non-vacuum process Shoko Tao, Taiga Harada, Kunihiko Tanaka (Nagaoka Univ.Tech.), Katsuhiko Moriya (Tsuruoka College) CPM2015-84 |
CuBr1-xIx thin films were prepared as a variable band gap transparent p-type semiconductor, by a sol-gel method which is... [more] | CPM2015-84 pp.5-8 |
| EMD | 2015-11-06 11:25 |
Miyagi | Tohoku University, School of engineering, Aoba memorial hall | Magnetic Pulse Spot Welding of Flexible Printed Circuits Tomokatsu Aizawa (Tokyo Metropolitan College), Yoshitaka Sugiyama (Yazaki Corporation), Mehrdad Kashani (Tokyo Metropolitan College), Kenichi Hanazaki (Yazaki Corporation) EMD2015-78 |
This paper describes a novel spot welding technique for overlapped copper foils of flexible printed circuits (FPC) and i... [more] | EMD2015-78 pp.63-66 |
| EMCJ, EMD | 2015-07-10 15:20 |
Tokyo | Kikai-Shinko-Kaikan Bldg. | Magnetic Pulse Seam Welding of Al/Cu Sheets using Flat Two-Turn Coil Tomokatsu Aizawa (Tokyo Metropolitan College) EMCJ2015-50 EMD2015-27 |
This paper describes a novel welding technique of an Al sheet to a Cu sheet and its experimental results. When a dischar... [more] | EMCJ2015-50 EMD2015-27 pp.37-40 |
| SDM | 2015-03-02 10:35 |
Tokyo | Kikai-Shinko-Kaikan Bldg | [Invited Talk]
Integration Technology of 3D FPGA with Performance Scalability and Function Flexibility Kenichi Takeda, Mayu Aoki (Hitachi) SDM2014-163 |
Three-layer stacked wafer with CMOS devices was demonstrated by using hybrid wafer bonding and via-last through silicon ... [more] | SDM2014-163 pp.7-11 |
| SDM | 2015-03-02 14:55 |
Tokyo | Kikai-Shinko-Kaikan Bldg | [Invited Talk]
Effect of microtexture in electroplated copper thin-film interconnections on their migration resistance Ken Suzuki, Takery Kato, Hideo Miura (Tohoku Univ) SDM2014-168 |
Both electrical and mechanical properties of electroplated copper thin-films vary drastically depending on their unique ... [more] | SDM2014-168 pp.33-38 |
| US | 2014-12-15 15:50 |
Tokyo | Tokyo Institute of Technology, Suzukakedai Campus | Ultrasonic Welding of Electronic Parts and Devices Using a Long and Thin Complex Transverse Vibration Welding Tip
-- Ultrasonic complex vibration welding of narrow and deep welding positions -- Jiromaru Tsujino (Kanagawa Univ./Asahi EMS) US2014-70 |
Ultrasonic complex vibration welding was applied for deep and narrow area of electronic parts positioned at long distanc... [more] | US2014-70 pp.29-34 |
| OME, IEE-DEI | 2014-07-10 16:20 |
Nagano | Photo-induced modulation of terahertz transmission in organic/inorganic semiconductor layered structure and application to active metamaterial Tatsunosuke Matsui, Ryosuke Takagi (Mie Univ.), Keisuke Takano, Masanori Hangyo (Osaka Univ.) OME2014-34 |
Photo-induced terahertz (THz) transmission modulation through Si substrate coated with thin layer of copper phthalocyani... [more] | OME2014-34 pp.33-38 |
|
| ICSS, ISEC, SITE, EMM, IPSJ-CSEC, IPSJ-SPT [detail] | 2014-07-03 14:15 |
Hokkaido | San-Refure Hakodate | Security of RSA with Many Decryption Exponents Atsushi Takayasu, Noboru Kunihiro (Univ. of Tokyo) ISEC2014-19 SITE2014-14 ICSS2014-23 EMM2014-19 |
When we use small secret exponents, RSA becomes efficient for its decryption cost and signature generation cost. However... [more] | ISEC2014-19 SITE2014-14 ICSS2014-23 EMM2014-19 pp.93-96 |
| ED | 2013-12-17 11:00 |
Miyagi | Research Institute of Electrical Communication Tohoku University | Visualization technology of insulated copper wire snapping implemented with THz wave Seiya Takahashi, Yuta Nakamura, Tadao Tanabe, Kensaku Maeda, Kaori Nakajima, Tomoyuki Hamano, Yutaka Oyama (Tohoku Univ.) ED2013-104 |
A novel non-destructive inspection method using terahertz waves for the detection of broken wires in copper cables shiel... [more] | ED2013-104 pp.81-86 |
| EMD | 2013-11-17 08:45 |
Overseas | Huazhong University of Science and Technology, Wuhan, P.R.China | Study on arc characteristics of a DC bridge-type contactor in air and nitrogen at different pressure Xue Zhou, Wenying Yang, Xinglei Cui, Guofu Zhai (Harbin Inst. of Tech.) EMD2013-102 |
High voltage DC contactors find their increasing markets in multiple fields, such as battery manage module and distribut... [more] | EMD2013-102 pp.111-114 |
| EMD | 2013-05-17 13:35 |
Hokkaido | Chitose Arcadia Plaza | Magnetic Pulse Welding of Copper Foils on Rigid and Flexible Printed Circuit Boards Tomokatsu Aizawa (Tokyo Metropolitan College) EMD2013-1 |
This paper describes a novel welding technique for copper foils on rigid and flexible printed circuit boards and its exp... [more] | EMD2013-1 pp.1-4 |
| SDM, ED, CPM | 2013-05-17 14:30 |
Shizuoka | Shizuoka Univ. (Hamamatsu) Graduate School of Sci. and Technol. | Evaluation of photocatalytic properties of TiO2 films with loading Cu and Fe Yoshitaka Yamada, Go Atsumi, Ryo Shiraki, Masaaki Isai (Shizuoka Univ.), Yoji Yasuda, Yoichi Hoshi (Tokyo Kougei Univ.) ED2013-32 CPM2013-17 SDM2013-39 |
It is known that loaded some metals on the TiO2 surface facilitate their organic decomposition properties. In this study... [more] | ED2013-32 CPM2013-17 SDM2013-39 pp.87-92 |
| EMD | 2012-12-21 13:45 |
Tokyo | Kikai-Shinko-Kaikan Bldg. | [Special Talk]
Fundamental Experiments for Magnetic Pulse Welding of Electric and Electronic Parts Tomokatsu Aizawa (Tokyo Metropolitan College) EMD2012-92 |
Copper and aluminum materials such as a sheet, foil, a terminal board, a wire are connected by magnetic pulse welding (M... [more] | EMD2012-92 pp.7-12 |
| EMD | 2012-11-30 11:05 |
Chiba | Chiba Institute of Technology | Study on arc behaviors at opening a 270V resistive load by bridge-type contacts under magnetic field Xue Zhou, Xinglei Cui, Zhikai Zhou, Guofu Zhai (Harbin Inst. of Tech.) EMD2012-67 |
Bridge-type contacts are mainly used in high voltage direct current contactors for their performance of arc extinguishme... [more] | EMD2012-67 pp.19-24 |
| EMD | 2012-10-19 14:00 |
Tokyo | Fuji Electric FA Components & Systems Co., Ltd. | Parallel Seam Welding of Aluminum and Copper Sheets for Electro-Conductive Connection by Magnetic Pulse Welding Method (2nd Report) Tomokatsu Aizawa, Kazuo Matsuzawa, Keigo Okagawa (Tokyo Metropolitan College) EMD2012-60 |
This paper describes parallel seam welding technique of aluminum and copper sheets by magnetic pulse welding method and ... [more] | EMD2012-60 pp.1-6 |
| MW | 2012-10-19 09:20 |
Tochigi | Utsunomiya Univ. | Experimental study on the microwave surface resistance of the copper-clad dielectric substrates Yusuke Shimoda, Koichi Kikuchi, Takashi Shimizu, Yoshinori Kogami (Utsunomiya Univ.) MW2012-98 |
Copper clad dielectric substrate is used for high-frequency planar circuits. The surface of the dielectric plate is roug... [more] | MW2012-98 pp.99-104 |
| EMM, ISEC, SITE, ICSS, IPSJ-CSEC, IPSJ-SPT [detail] | 2012-07-20 14:20 |
Hokkaido | An Improved Algorithm for Approximate GCD Problems Atsushi Takayasu, Noboru Kunihiro (UT) ISEC2012-35 SITE2012-31 ICSS2012-37 EMM2012-27 |
In this paper, we analyze multivariate approximate common divisor problem(ACDP), given approximate multiples of the inte... [more] | ISEC2012-35 SITE2012-31 ICSS2012-37 EMM2012-27 pp.189-194 |
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