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All Technical Committee Conferences (Searched in: All Years)
| Committee | Date Time | Place | Paper Title / Authors | Abstract | Paper # | |
| VLD, DC, RECONF, ICD, IPSJ-SLDM (Joint) [detail] |
2020-11-18 10:20 |
Online | Online |  VLD2020-29 ICD2020-49 DC2020-49 RECONF2020-48 |
In this paper, we propose a method for estimating the contact angle of a droplet in the range from 0 to about 180 degree... [more] | VLD2020-29 ICD2020-49 DC2020-49 RECONF2020-48 pp.106-109 |
| MW | 2018-06-21 15:55 |
Toyama | Sunship Toyama | Capacitance Matrix Calculation of Automotive Wire Harness by Using Machine Learning Tadatoshi Sekine (Shizuoka Univ.) MW2018-21 |
In this report, the author proposes an efficient method to estimate the capacitance matrix of an automotive wire harness... [more] | MW2018-21 pp.19-24 |
| EMCJ | 2017-01-19 12:35 |
Fukuoka | Kyushu Institute of Technology | Reduction Technique of Far End Cross Talk by Attached Capacitor Method
-- Method of Determination Optimum Attached Capacitance -- Yoshiaki Mori, Shinichi Sasaki (Saga Univ) EMCJ2016-108 |
In recent years, with the miniaturization and multi-function-alization of information equipment, the influence of Far-En... [more] | EMCJ2016-108 pp.1-4 |
| MW | 2015-11-19 14:45 |
Okinawa | Univ. of the Ryukyus | Generation of Negative Capacitance On a Basis of Operational Amplifier Based Negative Impedance Converters Shoji Yamanaka, Kenichi Matsumoto, Yasushi Horii (Kansai Univ) MW2015-126 |
Some people are working on negative impedance converters (NICs) to generate Non-Foster reactance, that is, negative capa... [more] | MW2015-126 pp.35-40 |
| EE, IEE-SPC | 2014-07-11 11:30 |
Hiroshima | Hiroshima Institute of Technology | Effects of Capacitance and Inductance at the time of Opening the DC Distribution Path Naoya Kubo, Kazunori Nishimura (Hiroshima Institute of Tech.), Hiroshi Morita, Kazuhiko Taniguchi (Kinden) EE2014-14 |
In a study on the safety of the DC wiring, by different conditions capacitances and inductances included in the DC circu... [more] | EE2014-14 pp.51-56 |
| AP | 2014-05-30 14:35 |
Okinawa | Okinawa Industory Support Center | Examined of Dual Band for the metal-plate loaded capacitance grid type AMC substrate Shuhei Iwakata, Shigeru Makino, Keisuke Noguchi, Tetsuo Hirota, Kenji Itoh, Masaki Kotaka (Kanazawa Inst. of Tech.), Tetsuo Moroya (KTC) AP2014-37 |
About AMC substrate using a metal plate loading capacitance grid, conditions of dual frequency, clar-ify the relationshi... [more] | AP2014-37 pp.95-98 |
| AP | 2013-08-29 14:50 |
Kanagawa | Yokosuka | Reactance Engineering Based on Non-Forster Circuits Yasushi Horii, Takuya Kaneko, Shogo Takagi, Risa Matsubara (Kansai Univ.) AP2013-66 |
Recently, negative impedance converter (NIC) technologies have been strongly focused on due to their capability of produ... [more] | AP2013-66 pp.25-30 |
| EMCJ | 2012-01-27 15:05 |
Fukuoka | Kyushu Univ. | Capacitance addition for reduction of Far-End-Crosstalk Kazuaki Terashima, Shinichi Sasaki, Akihiro Fukuda (Saga Univ) EMCJ2011-126 |
In recent years, crosstalk reduction between parallel Signal Lines is one of the important problem with improvement in t... [more] | EMCJ2011-126 pp.87-92 |
| SDM | 2011-10-21 14:50 |
Miyagi | Tohoku Univ. (Niche) | Electrical Characterization Techniques for Si Substrate Damage during Plasma Etching Yoshinori Nakakubo, Koji Eriguchi, Asahiko Matsuda, Yoshinori Takao, Kouichi Ono (Kyoto Univ.) SDM2011-111 |
We present analysis techniques for plasma process-induced damage in the Si substrate. The techniques are based on the el... [more] | SDM2011-111 pp.79-84 |
| CPM, ED, SDM | 2008-05-16 15:30 |
Aichi | Nagoya Institute of Technology | Characterization of deep levels in undoped 6H-SiC by Current Deep-Level Transient Spectroscopy method Kosuke Kito, Masashi Kato, Masaya Ichimura (Nagoya Inst. of Tech) ED2008-21 CPM2008-29 SDM2008-41 |
We characterized deep levels that influence a semi-insulating property by current-voltage, capacitance-voltage and curre... [more] | ED2008-21 CPM2008-29 SDM2008-41 pp.101-106 |
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