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All Technical Committee Conferences (Searched in: All Years)
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Search Results: Conference Papers |
Conference Papers (Available on Advance Programs) (Sort by: Date Descending) |
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Committee |
Date Time |
Place |
Paper Title / Authors |
Abstract |
Paper # |
ICD, CPM |
2005-09-09 11:20 |
Tokyo |
Kikai-Shinko-Kaikan Bldg. |
Development of New Surface Finish Technology for Package Substrates with Excellent Bondability Kiyotaka Tsukada (IBIDEN) |
This Paper describes the characteristics, development, and application of
the surface finish technologies for chip pack... [more] |
CPM2005-100 ICD2005-110 pp.23-27 |
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