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All Technical Committee Conferences (Searched in: All Years)
| Committee | Date Time | Place | Paper Title / Authors | Abstract | Paper # | |
| OME, IEE-DEI | 2023-01-18 14:45 |
Aichi | Aichi Himaka island ホテル浦島 | [Invited Talk]
Research trend of Tin based perovskite solar cell
-- From Lead free perovskite solar cell to all perovskite tandem solar cells -- Shuzi Hayase (UEC)  OME2022-64 |
The certified efficiency of the lead halide perovskite solar cell (Pb-PVK PV) is now 25.7 %, which is close to that of s... [more] | OME2022-64 pp.4-7 |
| OME, IEE-DEI | 2021-03-01 13:30 |
Online | Online | [Invited Talk]
Trend for Research and Development on Pb-free Sn-perovskite solar cells Shuzi Hayase (UEC) OME2020-19 |
Certified efficiency of the solar cells consisting of conventional Pb perovskite as the light harvesting layer reached 2... [more] | OME2020-19 pp.1-3 |
| EMD | 2020-03-06 14:30 |
Chiba | CHIBA Institute of Technology Tsudanuma Campus (Cancelled but technical report was issued) |
Whisker formation and growth mechanism in tin plating Inoue Shintaro, Iida Kazuo (Mie Univ.) EMD2019-64 |
Reliability of connection is required for connectors, and tin is widely used for surface treatment. However, in the plat... [more] | EMD2019-64 pp.25-30 |
| EMD | 2017-03-03 14:45 |
Chiba | Observation of whisker growth in various tin plating Yuki Wada, Kazuo Iida (Mie Univ.), Takafumi Akashi (ASAHI PLATING) EMD2016-105 |
Reliability of connection is required for connectors, and tin is widely used for surface treatment. However, in the plat... [more] | EMD2016-105 pp.25-28 |
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| EMD | 2015-05-15 14:25 |
Akita | Akita University Tegata Campus | Fretting Characteristics about Contact Load of Tin-plated Contacts Atsushi Shimizu, Yasushi Saitoh (AutoNetwork Tech.) EMD2015-3 |
The contact resistance between tin-plated contacts increases with rubbing under low contact load due to accumulated oxid... [more] | EMD2015-3 pp.13-18 |
| R | 2013-11-14 14:50 |
Osaka | Effect of Plate-Shape Ni-Sn IMC on the Growth Mechanism of Tin Whisker under Thermal Shock Stress Akira Saito, Akira Okamoto, Yoshihiro Iwahori, Makoto Ogawa (Mutrata MFG), Akihiro Motoki (Sabae Mutrata MFG) R2013-76 |
With the promotion of lead-free solder in these years, some segments have expressed concern about the possibility of tin... [more] | R2013-76 pp.11-16 |
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| R | 2013-11-14 15:15 |
Osaka | A Study on Sn-whisker growth by thermal cycle Sadanori Itou (Itoken office) R2013-77 |
Sn whisker grow up like curl shape under the thermal cycle test. However in some conditions, it grow up straight shape. ... [more] | R2013-77 pp.17-20 |
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| EMD, R | 2012-02-17 14:05 |
Kyoto | A Study for lath-like Compound growth factor in Sn-Ni metalic plate(2) Sadanori Ito (itoken), Masafumi Suzuki (omron), Tomio Taniguchi (UP) R2011-48 EMD2011-122 |
Lath-like Ni-Sn intermetallics grow in Sn plate layer on Ni plate and cause worse solderability. The ｃｏｍｐｏｕｎｄ appear in... [more] |
R2011-48 EMD2011-122 pp.37-40 |
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| EMD, R | 2012-02-17 15:05 |
Kyoto | Effect of Intermittent Time on Fretting Corrosion of Tin Plated Coupon Jumpei Yasuda, Kazuo Iida (Mie Univ.), Yasushi Saitoh (ANTech), Shigeru Sawada (Mie Univ.), Yasuhiro Hattori (ANTech) R2011-50 EMD2011-124 |
Recently, there is a problem as increasing contact resistance by fretting corrosion in automobile connector. This increa... [more] | R2011-50 EMD2011-124 pp.45-50 |
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| EMD, R | 2011-02-18 13:05 |
Shizuoka | Shizuoka Univ. (Hamamatsu) | Peculiar Phenomena for Increase in Friction Coefficient due to Application of Lubrication Terutaka Tamai, Shigeru Sawada (Mie Univ.), Yasuhiro Hattori (AN Lab.) R2010-42 EMD2010-143 |
For tin plated connector contacts, it was found that friction coefficient at lubricated contacts was higher than the fri... [more] | R2010-42 EMD2010-143 pp.1-6 |
| EMD | 2011-01-28 13:50 |
Tokyo | Japan Aviation Electronics Industry,Limited | Measurement of Contact Resistance Distribution in Fretting Corrosion Track for the Tin Plated Contacts Soushi Masui, Shigeru Sawada, Terutaka Tamai (Mie Univ), Yasuhiro Hattori (AN-Tech), Kazuo Iida (Mie Univ) EMD2010-137 |
It is observed that contact resistance for tin plated contact in automotive connectors increased due to fretting corrosi... [more] | EMD2010-137 pp.11-16 |
| EMD | 2011-01-28 14:15 |
Tokyo | Japan Aviation Electronics Industry,Limited | Fretting characteristics about the shape and weight of tin-plated contacts Tomishige Tai, Tetsuya Komoto (JAE) EMD2010-138 |
This paper, to describe the increase in contact resistance due fretting corrosion on tin-plated layer of the contact geo... [more] | EMD2010-138 pp.17-21 |
| EMD | 2010-03-05 13:00 |
Kanagawa | Yokohama National University | Relation between Oxidation Thickness and Contact Resistance on Fretting Corrosion of the Tin Plated Contacts Soshi Masui, Shigeru Sawada, Terutaka Tamai, Kazuo Iida (Mie Univ.) EMD2009-127 |
(To be available after the conference date) [more] | EMD2009-127 pp.1-4 |
| EMD | 2010-03-05 16:05 |
Kanagawa | Yokohama National University | Influence of Paraffin on Contact Resistance of Sn and Au Contacts Keisuke Taniguchi, Masaru Takeshita, Kazuo Iida, Yasushi Saitoh (Mie Univ.), Yasuhiro Hattori (AutoNetworks Technologies, Ltd.) EMD2009-138 |
The decrease of force for insertion of the automotive connector is attempted along with advancement of the miniaturizati... [more] | EMD2009-138 pp.45-48 |
| EMD, R | 2010-02-19 15:20 |
Osaka | Observation of wear status of tin plating for automotive connector at initial stage of sliding Shigeru Sawada, Terutaka Tamai (Mie Univ.), Yasuhiro Hattori (AutoNetworks Technologies, Ltd.), Kazuo Iida (Mie Univ.) R2009-56 EMD2009-123 |
Tin plated contacts are widely used for common electrical contact due to the inexpensive and reliability. On the other h... [more] | R2009-56 EMD2009-123 pp.37-42 |
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| EMD, R | 2010-02-19 15:45 |
Osaka | Physical characteristics of oxide film grown on tin plated contact surface of connectors under high temperatures in the air and its effect on contact resistance Yuya Nabeta, Shigeru Sawada, Yasushi Saitoh (Mie Univ.), Atsushi Shimizu, Yasuhiro Hattori (AutoNet Tech.), Terutaka Tamai (Mie Univ.) R2009-57 EMD2009-124 |
Tin plated surface used for contact surface such as connectors is usually covered with the oxide vfilm in the atmosphere... [more] | R2009-57 EMD2009-124 pp.43-48 |
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| EMD | 2009-03-06 16:35 |
Tokyo | Kougakuin Univ. | Growth Law of the Oxide Film Formed on the Tin Plated Contact Surface and Its Contact Resistance Characteristic
-- Ellipsometric Study -- Yuya Nabeta, Terutaka Tamai, Yasushi Saitoh, Shigeru Sawada, Kazuo Iida (Mie Univ.), Yasuhiro Hattori (AN Technorogies) EMD2008-146 |
Tin plated contacts has been applied widely to electrical contacts of electromechanical devices as well as gold plated c... [more] | EMD2008-146 pp.49-52 |
| OME | 2009-01-21 14:50 |
Aichi | Ｎａｇｏｙａ Ｕｎｉｖ． | Development of a novel silicone compound with high thermal endurance Hiroaki Cho, Fumito Sano, Shuhei Nakamura (Mie Univ.), Kazuyo Miyata (Japan Scie and Tech Agence Plaza Tokai), Wataru Shimizu, Yasushi Murakami (Shinshu Univ.) OME2008-90 |
Poly(dimethylsiloxane) (PDMS) is a base polymer of silicone compound which used, for example, as sealants, adhesives or ... [more] | OME2008-90 pp.43-48 |
| EMD | 2008-04-18 14:00 |
Tokyo | NTT Musashino Research and Development Center | Singularity of Contact Resistance Chracteristics for Tin Contacts Terutaka Tamai, Katsunori Hotta, Yasushi Saitoh (Mie Univ.), Yasuhiro Hattori (AutoNetworks Tech.) EMD2008-2 |
Abstract Plated Sn group is applied widely to connector contacts. Since surfaces of the Sn covered with its oxide films... [more] | EMD2008-2 pp.7-12 |
| EMD | 2006-10-20 14:25 |
Kanagawa | Study of Tin Whisker Generated by External Force Daisuke Machihara, Kazuomi Satou (JAE) |
Along with spread of lead free plating, problem of whiskers in tin plating becomes an important issue. Especially in con... [more] | EMD2006-50 pp.5-8 |
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