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All Technical Committee Conferences (Searched in: All Years)
| Committee | Date Time | Place | Paper Title / Authors | Abstract | Paper # | |
| ED | 2017-04-20 14:45 |
Miyagi | Fabrication of copper(I)-oxide-based resistors by ink-jet printing Satoshi Matsumura, Konami Izumi, Yasunori Yoshida, Hiroyuki Matsui, Daisuke Kumaki, Shizuo Tokito (Yamagata Univ.)  ED2017-4 |
In this research, we focused copper (I) oxide in order to fabricate high resistance resistors which could not be realize... [more] | ED2017-4 pp.13-16 |
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| EMD | 2017-03-03 13:05 |
Chiba | Influence of Break Arc on Electrode Mass Change of Electromagnetic Contactor
-- When Sourse Voltage is Less than Minimum Arc Voltage -- Syuwa Tanaka, Yuto Yamanaka, Koichiro Sawa, Kiyoshi Yoshida (NIT) EMD2016-99 |
In this experiment, the electromagnetic contactor with two pairs of Ag and Ni alloy contacts was used. The source volta... [more] | EMD2016-99 pp.1-4 |
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| EMD, R | 2017-02-17 14:00 |
Shiga | Omuron Kusatsu Factory | Effect of Hardness on Wear and Abrasion Resistance of Silver Plating on Copper Alloy Shigeru Sawada (SEI), Song-zhu Kure-chu, Rie Nakagawa, Toru Ogasawara, Hitoshi Yashiro (Iwate Uni.), Yasushi Saitoh (AN-Tech) R2016-63 EMD2016-90 |
This study is aimed at clarifying the mechanism of wear process for Ag plating with different hardness. The samples of A... [more] | R2016-63 EMD2016-90 pp.19-24 |
| SDM | 2017-02-06 10:05 |
Tokyo | Tokyo Univ. | [Invited Talk]
Impact of Dry Process Damage on Chemical Mechanical Planarization with Cu/low-k Structure Masako Kodera, Hiroyuki Yano, Naoto Miyashita (Toshiba) SDM2016-139 |
We evaluated the impact of process damage caused by dry or sputtering on chemical mechanical planarization (CMP) with Cu... [more] | SDM2016-139 pp.1-4 |
| EID, ITE-IDY, IEE-EDD, IEIJ-SSL, SID-JC [detail] | 2017-01-26 15:39 |
Tokushima | Tokushima Univ. | DC Biased Inorganic Electroluminescent Devices Having Cu2O Semiconductor Kantarou Suzuki, Kunitoshi Yanagihara, Noboru Miura (Meiji Univ.) EID2016-37 |
In order to achieve high efficient electroluminescence (EL), impact-excitation type EL device in which DC electric field... [more] | EID2016-37 pp.49-52 |
| EA, US (Joint) |
2017-01-25 13:00 |
Kyoto | Doshisha Univ. | [Poster Presentation]
Welding of coated copper wire and aluminum plate by ultrasonic vibration
-- Relationship between welding time and weld strength -- Hisato Suzuki, Takuya Asami, Hikaru Miura (Nihon Univ.) US2016-94 |
In recent years, there has been a demand for joining coated copper wires and solder electrodes in various electronic com... [more] | US2016-94 pp.117-121 |
| OME | 2016-12-26 16:00 |
Okinawa | Urazoe City Center | Anti-biofouling surfaces produced by nano-composite films and their evaluation Hideyuki Kanematsu (NIT Suzuka), Katsuhiko Sano (D&D), Takeshi Kougo, Akiko Ogawa, Nobumitsu Hirai (NIT Suzuka) OME2016-56 |
Biofilm can be defined as inhomogenous film-like matters formed on materials surfaces by bacterial activities. Even tho... [more] | OME2016-56 pp.11-15 |
| EMD, CPM, OME | 2016-06-17 16:20 |
Tokyo | Kikai-Shinko-Kaikan Bldg. | Magnetic Pulse Welding of Copper Foils on Rigid and Flexible Printed Circuit Boards (2nd Report) Tomokatsu Aizawa (Tokyo Metropolitan College), Yoshitaka Sugiyama (Yazaki) EMD2016-15 CPM2016-22 OME2016-25 |
This paper describes a novel welding technique for overlapped copper foils of rigid and flexible printed circuit boards.... [more] | EMD2016-15 CPM2016-22 OME2016-25 pp.39-42 |
| EMD | 2016-05-20 14:50 |
Hokkaido | Chitose Arcadia Plaza | Influence of electrical contact material on breaking characteristics of arc discharge at DC high voltage
-- Experimental results from DC200 to 500V of various materials -- Kiyoshi Yoshida, Koichiro Sawa, Hikaru Kanou, Hiroto Yamagishi (NIT), Kenji Suzuki, Koetsu Takaya (Fuji FA Comp.& Sys.) EMD2016-4 |
The experimental apparatus that is able to set opening velocity at wide-range of 1-200mm/s with an equal speed was used ... [more] | EMD2016-4 pp.19-24 |
| EMD | 2016-03-04 14:55 |
Saitama | Influence of Opening Velocity and Contact Material on Various Characteristics in Break Arc Hikaru Kanou, Hiroto Yamagishi, Koichiro Sawa, Kiyoshi Yoshida (NIT) EMD2015-104 |
The experimental apparatus that is able to set opening velocity at wide-range of 1-200mm/s with an equal speed was used ... [more] | EMD2015-104 pp.21-24 |
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| SDM | 2016-01-22 11:35 |
Tokyo | Sanjo Conference Hall, The University of Tokyo | In-situ ellipsometry of Cu surfaces immersed in BTA-H2O2 solutions Tatsuya Kawakami, Eiichi Kondoh, Mitsuhiro Watanabe (University of Yamanashi), Satomi Hamada, Shohei Shima, Hirokuni Hiyama (Ebara Corporation) SDM2015-111 |
During Cu CMP, Cu surface is oxidized by an oxidizer or a complexiation reagent. To inhibit oxidation, a corrosion inhib... [more] | SDM2015-111 pp.13-15 |
| CPM | 2015-11-06 13:20 |
Niigata | Machinaka Campus Nagaoka | Preparation of Cu halide transparent thin film by non-vacuum process Shoko Tao, Taiga Harada, Kunihiko Tanaka (Nagaoka Univ.Tech.), Katsuhiko Moriya (Tsuruoka College) CPM2015-84 |
CuBr1-xIx thin films were prepared as a variable band gap transparent p-type semiconductor, by a sol-gel method which is... [more] | CPM2015-84 pp.5-8 |
| EMCJ, EMD | 2015-07-10 15:20 |
Tokyo | Kikai-Shinko-Kaikan Bldg. | Magnetic Pulse Seam Welding of Al/Cu Sheets using Flat Two-Turn Coil Tomokatsu Aizawa (Tokyo Metropolitan College) EMCJ2015-50 EMD2015-27 |
This paper describes a novel welding technique of an Al sheet to a Cu sheet and its experimental results. When a dischar... [more] | EMCJ2015-50 EMD2015-27 pp.37-40 |
| SDM | 2015-03-02 14:55 |
Tokyo | Kikai-Shinko-Kaikan Bldg | [Invited Talk]
Effect of microtexture in electroplated copper thin-film interconnections on their migration resistance Ken Suzuki, Takery Kato, Hideo Miura (Tohoku Univ) SDM2014-168 |
Both electrical and mechanical properties of electroplated copper thin-films vary drastically depending on their unique ... [more] | SDM2014-168 pp.33-38 |
| US | 2014-12-15 15:50 |
Tokyo | Tokyo Institute of Technology, Suzukakedai Campus | Ultrasonic Welding of Electronic Parts and Devices Using a Long and Thin Complex Transverse Vibration Welding Tip
-- Ultrasonic complex vibration welding of narrow and deep welding positions -- Jiromaru Tsujino (Kanagawa Univ./Asahi EMS) US2014-70 |
Ultrasonic complex vibration welding was applied for deep and narrow area of electronic parts positioned at long distanc... [more] | US2014-70 pp.29-34 |
| OME | 2014-10-10 10:55 |
Osaka | Osaka University Nakanoshima Center | Photo-excited carrier transport of organic thin-film solar cell Mitsuru Inada, Nozomi Isobe, Tomoki Miyake, Shouzou Yamanaka, Tadashi Saitoh (Kansai Univ.) OME2014-38 |
We investigate photo-excited carrier lifetime of CuPc/C60-based organic thin-film solar cell to reveal the carrier trans... [more] | OME2014-38 pp.5-8 |
| OME, IEE-DEI | 2014-07-10 16:20 |
Nagano | Photo-induced modulation of terahertz transmission in organic/inorganic semiconductor layered structure and application to active metamaterial Tatsunosuke Matsui, Ryosuke Takagi (Mie Univ.), Keisuke Takano, Masanori Hangyo (Osaka Univ.) OME2014-34 |
Photo-induced terahertz (THz) transmission modulation through Si substrate coated with thin layer of copper phthalocyani... [more] | OME2014-34 pp.33-38 |
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| EMD | 2014-03-07 14:05 |
Kanagawa | Yokohama Nat'l Univ. | The simulation a different metal configuration changes in multi-point Eisuke Enomoto, Yu Kodama, Keisuke Fukuda, Yusuke Yanagi, Yoshitada Watanabe, Masaomi Arai (Kogakuin Univ) EMD2013-153 |
(To be available after the conference date) [more] | EMD2013-153 pp.17-20 |
| ED | 2013-12-17 11:00 |
Miyagi | Research Institute of Electrical Communication Tohoku University | Visualization technology of insulated copper wire snapping implemented with THz wave Seiya Takahashi, Yuta Nakamura, Tadao Tanabe, Kensaku Maeda, Kaori Nakajima, Tomoyuki Hamano, Yutaka Oyama (Tohoku Univ.) ED2013-104 |
A novel non-destructive inspection method using terahertz waves for the detection of broken wires in copper cables shiel... [more] | ED2013-104 pp.81-86 |
| OME | 2013-10-11 16:20 |
Osaka | Osaka Univ. Nakanoshima Center | Orientational control of Copper Phthalocyanine on Phosphonic Acid SAM Toshiki Onishi, Yasuko Koshiba, Masahiro Misaki, Kenji Ishida (Kobe Univ.) OME2013-66 |
Molecular Orientation and morphology of copper phthalocyanine (CuPc) thin films deposited on a phosphonic acid SAM coate... [more] | OME2013-66 pp.77-81 |
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