Committee |
Date Time |
Place |
Paper Title / Authors |
Abstract |
Paper # |
EMD |
2024-03-01 15:55 |
Chiba |
|
Study on wear of carbon brush at high current density Yuta Momiyama, Atsushi Gokita, Shota Kanazawa, Koichiro Sawa, Takahiro Ueno (NIT) EMD2023-46 |
[more] |
EMD2023-46 pp.42-45 |
AP, WPT (Joint) |
2024-01-18 16:25 |
Niigata |
Tokimate, Niigata University (Primary: On-site, Secondary: Online) |
[Invited Lecture]
A Low-cost antenna with wire structure on a finite ground plane. Akihiro Kawata (Fukuda Denshi) AP2023-176 |
An antenna with external dimensions of 75 x 24 x 10 mm was designed for the 2nd Small Antenna Competition. The structure... [more] |
AP2023-176 pp.84-88 |
SDM |
2023-02-07 14:40 |
Tokyo |
Tokyo Univ. (Primary: On-site, Secondary: Online) |
[Invited Talk]
New Approach for Epoxy Mold Compound Slurry in Advanced Packaging Technology Shogo Arata, Chiaki Noda, Yasuhiro Ichige, Satoyuki Nomura (Resonac), Trianggono Widodo, Nagatoshi Tsunoda, Xavier Brun (Intel) SDM2022-90 |
Chemical mechanical polishing (CMP) process has been a part of semiconductor manufacturing processes from front-end to b... [more] |
SDM2022-90 pp.23-26 |
OME, IEE-DEI |
2023-01-18 17:40 |
Aichi |
Aichi Himaka island ホテル浦島 |
Fabrication of Cu2O films on flexible PET substrates for Bending Sensor Application Ryosuke Nitta, Yuta Kubota, Nobuhiro Matsushita (Tokyo Tech) OME2022-69 |
A Cu2O film is fabricated on a flexible polyethylene terephthalate substrate for a bending sensor using the spin–spray m... [more] |
OME2022-69 pp.26-30 |
EE, IEE-SPC (Joint) |
2022-03-10 16:20 |
Online |
Online |
LLC Resonant Converter with Current Doubler Rectifier Circuit Using Leakage Inductance of Coupled Inductor Akito Tabata, Yoichi Isizuka (Nagasaki Univ.) EE2021-58 |
LLC resonant converters can achieve high power density and high power efficiency, and are widely used in many applicatio... [more] |
EE2021-58 pp.35-40 |
SDM |
2022-02-04 09:05 |
Online |
Online |
[Invited Talk]
Quantitative evaluation on barrier property of ultra-thin PVD-Co(W) films using lag-time method Takeshi Momose, Taewoong Kim, Yubin Deng, Momoko Deura (UTokyo), Akira Matsuo, Nobuo Yamaguchi (CANON ANELVA), Yukihiro Shimogaki (UTokyo) SDM2021-74 |
For the development of ultra-thin barrier layers for Cu interconnections in ultra large scale integration, it is essenti... [more] |
SDM2021-74 pp.1-4 |
ED, THz |
2021-12-20 16:35 |
Miyagi |
(Primary: On-site, Secondary: Online) |
[Invited Talk]
Development of coherent quantum THz sources based on single crystals of high-temperature superconductors Manabu Tsujimoto (AIST), Takanari Kashiwagi, Hidetoshi Minami, Kazuo Kadowaki (Univ. of Tsukuba) ED2021-54 |
In this paper, we describe recent progress on the development of coherent quantum terahertz sources based on single crys... [more] |
ED2021-54 pp.30-33 |
SDM |
2021-06-22 13:10 |
Online |
Online |
[Memorial Lecture]
Modification of states of metal copper and copper oxide due to isopropyl alcohol treatment Takezo Mawaki (Tohoku Univ.), Akinobu Teramoto (Hiroshima Univ.), Katsutoshi Ishii (Tokyo Electron Technology Solutions), Yoshinobu Shiba, Tomoyuki Suwa (Tohoku Univ.), Shuji Azumo, Akira Shimizu, Kota Umezawa (Tokyo Electron Technology Solutions), Rihito Kuroda, Yasuyuki Shirai, Shigetoshi Sugawa (Tohoku Univ.) SDM2021-22 |
The reduction of copper oxide by isopropyl alcohol (IPA) gas and its mechanism were investigated toward the selective pr... [more] |
SDM2021-22 pp.1-6 |
CPM |
2021-03-03 11:30 |
Online |
Online |
Fabrication of ZnO nanorods/CuO and ZnO nanorods/Cu₂O heterojunctions by Chemical bath Deposition Takuma Omoto, Tomoaki Terasako (Ehime Univ.), Masakazu Yagi (Natl. Inst. Technol. Kagawa Coll.) CPM2020-64 |
Copper (II) oxide (CuO) and copper (I) oxide (Cu2O) films were grown on Au/Ti/Si(100) substrates by conventional chemica... [more] |
CPM2020-64 pp.34-37 |
US |
2020-12-14 16:45 |
Online |
Online |
Creating Latticed Plane Texture Using Micro Ultrasonic Knurling Technology Shigeru Aoki (TMCIT), Yasunori Sakai (SIT), Tomohisa Tanaka (TIT) US2020-56 |
Sliding surface in mechanical system is required to move smoothly and stop at target position. It is necessary to develo... [more] |
US2020-56 pp.34-37 |
EE, OME, CPM |
2020-12-11 10:45 |
Online |
Online |
Introduction of Power DEM (Device Embedded Module) technology & CSIPOS Shigehiro Hayashi, Haruki Sueyoshi, Kanta Nogita (Fukuoka IST), Younggun HAN, Yoshihisa Katoh (CSIPOS), Tadashi Suetsugu (ukuoka Univ.) EE2020-16 CPM2020-48 OME2020-1 |
(To be available after the conference date) [more] |
EE2020-16 CPM2020-48 OME2020-1 pp.1-6 |
SDM |
2020-10-22 14:50 |
Online |
Online |
Modification of states of copper and copper oxide due to IPA treatment Takezo Mawaki (Tohoku Univ.), Akinobu Teramoto (Hiroshima Univ.), Katsutoshi Ishii (Tokyo Electron Technology Solutions), Yoshinobu Shiba, Tomoyuki Suwa (Tohoku Univ.), Shuji Azumo, Akira Shimizu, Kota Umezawa (Tokyo Electron Technology Solutions), Rihito Kuroda, Yasuyuki Shirai, Shigetoshi Sugawa (Tohoku Univ.) SDM2020-19 |
The reduction of copper oxide by isopropyl alcohol (IPA) gas and its mechanism were investigated toward the selective pr... [more] |
SDM2020-19 pp.25-29 |
MW, EST, EMCJ, PEM, IEE-EMC [detail] |
2020-10-23 13:40 |
Online |
Online |
Analytical Study on Near Field Magnetic Shielding Effectiveness of Perforated Laminated Sheet Using Copper and Magnetic Sheets Takahiro Seto (Aoyama Gakuin Univ.), Akihisa Tsuchiya (KISTEC), Ryosuke Suga (Aoyama Gakuin Univ.), Hideaki Sugama (KISTEC), Osamu Hashimoto (Aoyama Gakuin Univ.) EMCJ2020-45 MW2020-59 EST2020-47 |
The demand for shielding materials increases to suppress the wide-band radiation noise up to 30 MHz caused by high-speed... [more] |
EMCJ2020-45 MW2020-59 EST2020-47 pp.115-118 |
EE, IEE-SPC (Joint) |
2020-03-05 14:06 |
Nagasaki |
(Cancelled but technical report was issued) |
A Consideration of Loss Analysis Method for Magnetic Transformer in LLC DC-DC Converter Fumiya Shiraishi, Fumiya Iwasaki, Yuichi Yokoi (Nagasaki Univ.), Takahiro Koga (ANSYS), Yoichi Ishizuka (Nagasaki Univ.) EE2019-77 |
LLC DC-DC converters can achieve high power density and high power efficiency, and are used in many applications. The po... [more] |
EE2019-77 pp.13-18 |
EMD |
2019-03-01 16:00 |
Tokyo |
|
Arc Erosion of Brush at Sliding Contacts between Cu commutator and Carbon Brush Youdai Suzuki, Kaito Niiya, Kouichiro Sawa, Takahiro Ueno (NIT) EMD2018-73 |
Compact DC motors are used for driving fuel pumps used in automobiles due to their superior cost advantages. From the re... [more] |
EMD2018-73 pp.75-80 |
ED, LQE, CPM |
2018-11-30 09:50 |
Aichi |
Nagoya Inst. tech. |
Chemical Bath Deposition of Undoped and Li Doped CuO Films and Thier Structural and Electrical Properties Hideyuki Okada, Tomoaki Terasako, Kenji Gochoh, Naoya Hayashimoto (Ehime Univ.) ED2018-43 CPM2018-77 LQE2018-97 |
Undoped and Li-doped CuO films were grown on Au seed layers by chemical bath deposition (CBD) using the mixed aqueous so... [more] |
ED2018-43 CPM2018-77 LQE2018-97 pp.49-54 |
MW, WPT |
2018-04-27 14:50 |
Tokyo |
Kikai-Shinko-Kaikan Building |
S-band Tx Module with Cu Pillar Interconnection Si/GaN 3D Chip Embedding Substrate Kengo Kawasaki, Eigo Kuwata, Hidenori Ishibashi, Tomohiro Yao, Kiyoshi Ishida, Kazuhiro Maeda, Hironobu Shibata, Masaomi Tsuru, Kazutomi Mori, Mitsuhiro Shimozawa, Hiroshi Fukumoto (Mitsubishi Electric Corp.) WPT2018-5 MW2018-5 |
A SiGe chip and GaN chip packaged Tx module in S-band is represented. SiGe and GaN with Redistribution Layer (RDL) are i... [more] |
WPT2018-5 MW2018-5 pp.19-23 |
ICD, MW |
2018-03-02 11:00 |
Shiga |
The University of Shiga Prefecture |
Study on frequency dependence measurements of the interface relative conductivity using a dielectric rod resonator sandwiched between copper-clad dielectric substrates Yusaku Hirano, Takashi Shimizu, Yoshinori Kogami (Utsunomiya Univ.) MW2017-191 ICD2017-115 |
We studied on evaluation techniques of the interface relative conductivity using a dielectric rod resonator sandwiched b... [more] |
MW2017-191 ICD2017-115 pp.83-86 |
SDM |
2018-02-08 11:25 |
Tokyo |
Tokyo Univ. |
[Invited Talk]
Moisture Barrier Properties of Capping Graphene for Copper Metallization Kazuyoshi Ueno, Ploybussara Gomasang, Takumi Abe (SIT), Kenji Kawahara (Kyushu Univ.), Yoko Wasai (Horiba Techno), Nguyen Thanh Cuong (NIMS), Nataliya Nabatova-Gabain (Horiba Techno), Hiroki Ago (Kyushu Univ.), Susumu Okada (Univ. Tsukuba) SDM2017-98 |
(To be available after the conference date) [more] |
SDM2017-98 pp.5-9 |
US |
2017-12-11 13:30 |
Tokyo |
|
Welding of Coated Copper Wire and Aluminum Plate by Using Ultrasonic Vibration
-- Peeling Condition of the Coating -- Hisato Suzuki, Shinya Oishi, Takuya Asami, Hikaru Miura (Nihon Univ.) US2017-74 |
In recent years, there has been a demand for joining coated copper wires and solder electrodes in various electronic com... [more] |
US2017-74 pp.1-6 |