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Committee Date Time Place Paper Title / Authors Abstract Paper #
EMD 2015-05-15
14:25		 Akita Akita University Tegata Campus Fretting Characteristics about Contact Load of Tin-plated Contacts
Atsushi Shimizu, Yasushi Saitoh (AutoNetwork Tech.) EMD2015-3		 The contact resistance between tin-plated contacts increases with rubbing under low contact load due to accumulated oxid... [more] EMD2015-3
pp.13-18
R 2013-11-14
14:50		 Osaka   Effect of Plate-Shape Ni-Sn IMC on the Growth Mechanism of Tin Whisker under Thermal Shock Stress
Akira Saito, Akira Okamoto, Yoshihiro Iwahori, Makoto Ogawa (Mutrata MFG), Akihiro Motoki (Sabae Mutrata MFG) R2013-76		 With the promotion of lead-free solder in these years, some segments have expressed concern about the possibility of tin... [more] R2013-76
pp.11-16
CPM, ICD 2008-01-18
14:15		 Tokyo Kikai-Shinko-Kaikan Bldg Assessment Test for Solder Joint Reliability in Mobile Products
Masazumi Amagai, Hiroyuki Sano (TI Japan) CPM2007-144 ICD2007-155		 When a mobile phone is dropped, the frequency of occurrence of cracks in solder joints is high. Voids in intermetallic ... [more] CPM2007-144 ICD2007-155
pp.93-98
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