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All Technical Committee Conferences (Searched in: All Years)
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Search Results: Conference Papers |
Conference Papers (Available on Advance Programs) (Sort by: Date Descending) |
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Committee |
Date Time |
Place |
Paper Title / Authors |
Abstract |
Paper # |
VLD, DC, CPSY, RECONF, CPM, ICD, IE, IPSJ-SLDM, IPSJ-EMB, IPSJ-ARC (Joint) [detail] |
2018-12-06 13:00 |
Hiroshima |
Satellite Campus Hiroshima |
Test Time Reduction by Separating Delay Lines in Boundary Scan Circuit with Embedded TDC Satoshi Hirai, Hiroyuki Yotsuyanagi, Masaki Hashizume (Tokushima Univ.) VLD2018-56 DC2018-42 |
3D die-stacking technique using TSVs has gained much attention as a new integration method of IC.
However, faulty TSVs ... [more] |
VLD2018-56 DC2018-42 pp.119-124 |
VLD, DC, CPSY, RECONF, CPM, ICD, IE, IPSJ-SLDM, IPSJ-EMB, IPSJ-ARC (Joint) [detail] |
2018-12-06 13:50 |
Hiroshima |
Satellite Campus Hiroshima |
Study on the Applicability of ATPG Pattern for DFT Circuit Kohki Taniguchi, Hiroyuki Yotsuyanagi, Masaki Hashizume (Tokushima Univ.) VLD2018-58 DC2018-44 |
With high integration of IC, small delay faults have occurred as the cause of a circuit failure. As a design-for-testabi... [more] |
VLD2018-58 DC2018-44 pp.131-136 |
DC |
2018-02-20 10:35 |
Tokyo |
Kikai-Shinko-Kaikan Bldg. |
Reduction of Wire Length by Reordering Delay Elements in Boundary Scan Circuit with Embedded TDC Satoshi Hirai, Hiroyuki Yotsuyanagi, Masaki Hashizume (Tokushima Univ.) DC2017-79 |
TSV attracts attention as a new implementation method of interconnects between dies in 3DICs.
However, faulty TSVs may ... [more] |
DC2017-79 pp.13-18 |
VLD, DC, CPSY, RECONF, CPM, ICD, IE (Joint) [detail] |
2016-11-30 09:25 |
Osaka |
Ritsumeikan University, Osaka Ibaraki Campus |
Design of TDC Embedded in Scan FFs for Testing Small Delay Faults Shingo Kawatsuka, Hiroyuki Yotsuyanagi, Masaki Hashizume (Tokushima Univ.) VLD2016-62 DC2016-56 |
With improvement of semiconductor manufacturing process, small delay becomes more important cause of timing failures.
... [more] |
VLD2016-62 DC2016-56 pp.105-110 |
DC, CPSY |
2013-04-26 16:40 |
Tokyo |
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On-Chip Delay Measurement Using Adjacent Test Architecture Kentaroh Katoh (TNCT) CPSY2013-8 DC2013-8 |
This paper proposes an on-chip delay measurement using adjacent test architecture with TDC (Time to Digital Converter). ... [more] |
CPSY2013-8 DC2013-8 pp.43-48 |
DC |
2012-06-22 13:00 |
Tokyo |
Room B3-1 Kikai-Shinko-Kaikan Bldg |
An evaluation of a don't care filling method to improve fault sensitization coverage Ryosuke Wakasugi, Toshinori Hosokawa (Nihon Univ), Masayoshi Yoshimura (Kyusyu Univ) DC2012-9 |
A single stuck-at fault model and a transition fault model have been widely used to generate test patterns for VLSIs. Ho... [more] |
DC2012-9 pp.1-6 |
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