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Committee Date Time Place Paper Title / Authors Abstract Paper #
VLD, DC, CPSY, RECONF, CPM, ICD, IE, IPSJ-SLDM, IPSJ-EMB, IPSJ-ARC
(Joint) [detail]		 2018-12-05
15:05		 Hiroshima Satellite Campus Hiroshima Horizontal Wireless Bus for Free-Form SiP
Junichiro Kadomoto, Hidetsugu Irie, Shuichi Sakai (The Univ. of Tokyo) VLD2018-46 DC2018-32		 We propose a wireless bus interface which connects chips integrated side by side wirelessly. Implementing large coils an... [more] VLD2018-46 DC2018-32
pp.43-48
ICD, ITE-IST 2011-07-22
15:20		 Hiroshima Hiroshima Institute of Technology [Invited Talk] Implementation of Broadband Wireless Communication System Using Frequency-Domain Equalization
Suguru Kameda (Tohoku Univ.) ICD2011-35		 Frequency-domain equalization (FDE) method is necessary
for realizing "Dependable Air",
which is broadband and wide-ar... [more]		 ICD2011-35
pp.113-118
VLD, DC, IPSJ-SLDM, CPSY, RECONF, ICD, CPM
(Joint) [detail]		 2009-12-04
13:25		 Kochi Kochi City Culture-Plaza [Invited Talk] A Project on Dynamically Reconfigurable Processors: MuCCRA -- Design emvironment, Low Power design and 3D wireless interconnect --
Hideharu Amano (Keio Univ.) RECONF2009-51		 Dynamically reconfigurable processor project MuCCRA(Multi-Core
Configurable Reconfigurable Architecture) aims to establ... [more]		 RECONF2009-51
pp.61-66
ED 2009-07-31
11:15		 Osaka Osaka Univ. Icho-Kaikan Study of Electroless Copper Plating for Through Si Via Filling
Fumihiro Inoue, Takumi Yokoyama (Kansai Univ.), Kazuhiro Yamamoto, Shukichi Tanaka (NiCT), Shoso Shingubara (Kansai Univ.) ED2009-111		 In recent studies, The formation of through-Silicon via hole (TSV) which stacks multiple layers of thin Si substrates is... [more] ED2009-111
pp.47-50
 Results 1 - 4 of 4  /   
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