IEICE Technical Committee Submission System
Conference Schedule		 Online Proceedings
[Sign in]
Tech. Rep. Archives
    [Japanese] / [English] 
( Committee/Place/Topics  ) --Press->
 
( Paper Keywords:  /  Column:Title Auth. Affi. Abst. Keyword ) --Press->

All Technical Committee Conferences  (Searched in: All Years)

Search Results: Conference Papers
 Conference Papers (Available on Advance Programs)  (Sort by: Date Descending)
 Results 1 - 3 of 3  /   
Committee Date Time Place Paper Title / Authors Abstract Paper #
ICD, CPSY, CAS 2017-12-14
15:10		 Okinawa Art Hotel Ishigakijima Comparisons of Wire Bonding and Flip-Chip Bonding in High Frequency Hysteretic DC-DC Buck Converter
Yuki Karasawa, Yusuke Gotou, Shintaro Hara, Takanobu Fukuoka, Kousuke Miyaji (Shinshu Univ.) CAS2017-92 ICD2017-80 CPSY2017-89		 This work compares high frequency hysteretic buck converters implemented by chip-on-board wire bonding and flip-chip bon... [more] CAS2017-92 ICD2017-80 CPSY2017-89
p.129
ICD 2014-01-28
15:00		 Kyoto Kyoto Univ. Tokeidai Kinenkan [Poster Presentation] Spatially Arranged Microelectrode Probes using Wire Bonding Technology
Wataru Tonomura, Satoshi Konishi (Ritsumeikan Univ.) ICD2013-118		 This paper presents spatially arranged microelectrodes using a combination of wire bonding and laser machining. The wire... [more] ICD2013-118
p.45
ICD, CPM 2005-09-09
11:20		 Tokyo Kikai-Shinko-Kaikan Bldg. Development of New Surface Finish Technology for Package Substrates with Excellent Bondability
Kiyotaka Tsukada (IBIDEN) 		This Paper describes the characteristics, development, and application of
the surface finish technologies for chip pack... [more]		 CPM2005-100 ICD2005-110
pp.23-27
 Results 1 - 3 of 3  /   
Choose a download format for default settings. [NEW !!]
Text format pLaTeX format CSV format BibTeX format
Copyright and reproduction : All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034)

[Return to Top Page]

[Return to IEICE Web Page]
The Institute of Electronics, Information and Communication Engineers (IEICE), Japan