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SDM 2021-01-28
14:05		 Online Online [Invited Talk] Secure 3D CMOS Chip Stacks with Backside Buried Metal Power Delivery Networks for Distributed Decoupling Capacitance
Kazuki Monta (Kobe Univ.) SDM2020-51		 In semiconductor integrated circuits, power signal integrity(PSI) and electromagnetic compatibility caused by power supp... [more] SDM2020-51
pp.8-12
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