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Committee Date Time Place Paper Title / Authors Abstract Paper #
LQE, OPE, SIPH 2018-12-06
17:10		 Tokyo Keio University Examination of Chip-on-Wafer Plasma Activated Bonding Technology for III-V on Si hybrid Photonic Integrated Circuits
LIU BAI (Tokyo Tech), Takehiko Kikuchi (SEI), Takuya Mitarai, Nobuhiko Nishiyama (Tokyo Tech), Hideki Yagi (SEI), Tomohiro Amemiya, Shigehisa Arai (Tokyo Tech) OPE2018-127 LQE2018-137 SIPH2018-43		  [more] OPE2018-127 LQE2018-137 SIPH2018-43
pp.149-153
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