IEICE Technical Committee Submission System
Conference Schedule
Online Proceedings
[Sign in]
Tech. Rep. Archives
    [Japanese] / [English] 
( Committee/Place/Topics  ) --Press->
 
( Paper Keywords:  /  Column:Title Auth. Affi. Abst. Keyword ) --Press->

All Technical Committee Conferences  (Searched in: All Years)

Search Results: Conference Papers
 Conference Papers (Available on Advance Programs)  (Sort by: Date Descending)
 Results 1 - 3 of 3  /   
Committee Date Time Place Paper Title / Authors Abstract Paper #
CPM 2014-10-25
09:40
Nagano   Characterization of low-temperature deposited SiNx films applicable to 3D/2.5D-IC
Mayumi B. Takeyama, Masaru Sato (Kitami Inst. of Tech.), Yasushi Kobayashi, Yoshihiro Nakata, Tomoji Nakamura (FUJITSU LAB.LTD.), Atsushi Noya (Kitami Inst. of Tech.) CPM2014-115
3-dimensional stacked LSI and/or 2.5-D IC is attracted much attention to solve the issues how to develop the integration... [more] CPM2014-115
pp.53-56
CPM 2013-10-24
16:55
Niigata Niigata Univ. Satellite Campus TOKIMEITO Properties of SiNx films prepared by low process temperature
Mayumi B. Takeyama, Masaru Sato (Kitami Inst. of Tech.), Yoshihiro Nakata, Yasushi Kobayashi, Tomoji Nakamura (FUJITSU LAB.), Atsushi Noya (Kitami Inst. of Tech.) CPM2013-100
3-dimensional stacked LSI is attracted much attention to solve the issues how to develop the integration density and/or ... [more] CPM2013-100
pp.35-39
CPM 2012-08-09
09:50
Yamagata   Low temperature deposition of SiNx thin films by radical-assisted reaction
Mayumi B. Takeyama, Masaru Sato (Kitami Inst. Technol.), Yoshihiro Nakata, Yasushi Kobayashi, Tomoji Nakamura (Fujitsu Lab. Ltd.), Atsushi Noya (Kitami Inst. Technol.) CPM2012-45
3-dimensional stacked LSI is of high interest to overcome the issues how to develop the integration density and/or funct... [more] CPM2012-45
pp.51-54
 Results 1 - 3 of 3  /   
Choose a download format for default settings. [NEW !!]
Text format pLaTeX format CSV format BibTeX format
Copyright and reproduction : All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034)


[Return to Top Page]

[Return to IEICE Web Page]


The Institute of Electronics, Information and Communication Engineers (IEICE), Japan