|
|
All Technical Committee Conferences (Searched in: All Years)
|
|
Search Results: Conference Papers |
Conference Papers (Available on Advance Programs) (Sort by: Date Descending) |
|
Committee |
Date Time |
Place |
Paper Title / Authors |
Abstract |
Paper # |
CPM |
2014-10-25 09:40 |
Nagano |
|
Characterization of low-temperature deposited SiNx films applicable to 3D/2.5D-IC Mayumi B. Takeyama, Masaru Sato (Kitami Inst. of Tech.), Yasushi Kobayashi, Yoshihiro Nakata, Tomoji Nakamura (FUJITSU LAB.LTD.), Atsushi Noya (Kitami Inst. of Tech.) CPM2014-115 |
3-dimensional stacked LSI and/or 2.5-D IC is attracted much attention to solve the issues how to develop the integration... [more] |
CPM2014-115 pp.53-56 |
CPM |
2013-10-24 16:55 |
Niigata |
Niigata Univ. Satellite Campus TOKIMEITO |
Properties of SiNx films prepared by low process temperature Mayumi B. Takeyama, Masaru Sato (Kitami Inst. of Tech.), Yoshihiro Nakata, Yasushi Kobayashi, Tomoji Nakamura (FUJITSU LAB.), Atsushi Noya (Kitami Inst. of Tech.) CPM2013-100 |
3-dimensional stacked LSI is attracted much attention to solve the issues how to develop the integration density and/or ... [more] |
CPM2013-100 pp.35-39 |
CPM |
2012-08-09 09:50 |
Yamagata |
|
Low temperature deposition of SiNx thin films by radical-assisted reaction Mayumi B. Takeyama, Masaru Sato (Kitami Inst. Technol.), Yoshihiro Nakata, Yasushi Kobayashi, Tomoji Nakamura (Fujitsu Lab. Ltd.), Atsushi Noya (Kitami Inst. Technol.) CPM2012-45 |
3-dimensional stacked LSI is of high interest to overcome the issues how to develop the integration density and/or funct... [more] |
CPM2012-45 pp.51-54 |
|
|
|
Copyright and reproduction :
All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034)
|
[Return to Top Page]
[Return to IEICE Web Page]
|