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Committee Date Time Place Paper Title / Authors Abstract Paper #
SDM 2016-01-22
10:05		 Tokyo Sanjo Conference Hall, The University of Tokyo [Invited Talk] Reliability Results of 4 million Micro Bump Interconnections of 3D Stacked 16 M Pixel Image Sensor
Yoshiaki Takemoto, Naohiro Takazawa, Mitsuhiro Tsukimura, Haruhisa Saito, Toru Kondo, Hideki Kato, Jun Aoki, Kenji Kobayashi, Shunsuke Suzuki, Yuichi Gomi, Seisuke Matsuda, Yoshitaka Tadaki (Olympus) SDM2015-108		 We evaluated the reliability of 3D stacked CMOS image sensors (CISs) with 4 million micro bump inter-connections at a 7.... [more] SDM2015-108
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