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ICD, SDM 2008-07-18
11:20		 Tokyo Kikai-Shinko-Kaikan Bldg. [Invited Talk] Problems and Prospect of 3D Integration using Wireless and Optical Interconnection Technologies
Atsushi Iwata, Shin Yokoyama (Hiroshima Univ.) SDM2008-143 ICD2008-53		 n 3-D integration technology which aims to enhance integration scale and performance, chip-to-chip interconnection is th... [more] SDM2008-143 ICD2008-53
pp.89-94
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