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CPM
,
EMD
,
OME
2006-06-30
14:25
Tokyo
Kikai-Shinko-Kaikan Bldg.
A Consideration of relation between solbility parameters for polymer material and adhesion
Makito Morii
(
OMRON
)
The mechanical device combines various materials, and achieves the function. The joint by the oak and bonding is used as...
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EMD2006-10
CPM2006-34
OME2006-44
pp.29-32
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