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All Technical Committee Conferences (Searched in: All Years)
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Search Results: Conference Papers |
Conference Papers (Available on Advance Programs) (Sort by: Date Descending) |
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Committee |
Date Time |
Place |
Paper Title / Authors |
Abstract |
Paper # |
VLD, DC, IPSJ-SLDM, CPSY, RECONF, ICD, CPM (Joint) [detail] |
2013-11-27 14:00 |
Kagoshima |
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[Invited Talk]
Circuit design for 3D-stacking using TSV interconnects Kenichi Osada, Futoshi Furuta, Kenichi Takeda (Hitachi) VLD2013-73 CPM2013-117 ICD2013-94 CPSY2013-58 DC2013-39 RECONF2013-41 |
To improve the performance of 3D-stacking using TSV interconnects, circuit techniques were developed. To improve Z-axis ... [more] |
VLD2013-73 CPM2013-117 ICD2013-94 CPSY2013-58 DC2013-39 RECONF2013-41 pp.93-96(VLD), pp.55-58(CPM), pp.55-58(ICD), pp.1-4(CPSY), pp.93-96(DC), pp.13-16(RECONF) |
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