IEICE Technical Committee Submission System
Conference Schedule		 Online Proceedings
[Sign in]
Tech. Rep. Archives
    [Japanese] / [English] 
( Committee/Place/Topics  ) --Press->
 
( Paper Keywords:  /  Column:Title Auth. Affi. Abst. Keyword ) --Press->

All Technical Committee Conferences  (Searched in: All Years)

Search Results: Conference Papers
 Conference Papers (Available on Advance Programs)  (Sort by: Date Descending)
 Results 1 - 1 of 1  /   
Committee Date Time Place Paper Title / Authors Abstract Paper #
EMD, LQE, OPE, CPM, R 2014-08-22
14:25		 Hokkaido Otaru Economy Center Opto-electronic hybrid integrated chip packaging technology for silicon photonic platform using gold-stud bump bonding
Mitsuo Usui, Kotaro Takeda, Hirooki Hirata, Hiroshi Fukuda, Tai Tsuchizawa, Hidetaka Nishi, Rai Kou, Tatsuro Hiraki, Kentaro Honda, Masafumi Nogawa, Koji Yamada, Tsuyoshi Yamamoto (NTT) R2014-45 EMD2014-50 CPM2014-65 OPE2014-75 LQE2014-49		 We propose a new solder-free and low-temperature (200 ℃ or less) flip-chip integration technology for silicon photonic p... [more] R2014-45 EMD2014-50 CPM2014-65 OPE2014-75 LQE2014-49
pp.109-114
 Results 1 - 1 of 1  /   
Choose a download format for default settings. [NEW !!]
Text format pLaTeX format CSV format BibTeX format
Copyright and reproduction : All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034)

[Return to Top Page]

[Return to IEICE Web Page]
The Institute of Electronics, Information and Communication Engineers (IEICE), Japan