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 Conference Papers (Available on Advance Programs)  (Sort by: Date Descending)
 Results 1 - 9 of 9  /   
Committee Date Time Place Paper Title / Authors Abstract Paper #
SDM 2024-02-21
11:25
Tokyo Tokyo University-Hongo-Engineering Bldg.4
(Primary: On-site, Secondary: Online)
[Invited Talk] Development of Backside Buried Metal Layer Technology to Enhance Power Integrity of Three-Dimensional Integrated Circuits
Naoya Watanabe, Yuuki Araga, Haruo Shimamoto (AIST), Makoto Nagata (Kobe Univ.), Katsuya Kikuchi (AIST) SDM2023-83
 [more] SDM2023-83
pp.9-15
ICD, SDM, ITE-IST [detail] 2020-08-06
13:50
Online Online Over-the-top Si Interposer Embedding Backside Buried Metal to Reduce Power Supply Impedance
Takuji Miki, Makoto Nagata, Akihiro Tsukioka (Kobe Univ.), Noriyuki Miura (Osaka Univ.), Takaaki Okidono (ECSEC), Yuuki Araga, Naoya Watanabe, Haruo Shimamoto, Katsuya Kikuchi (AIST) SDM2020-5 ICD2020-5
A 2.5D structure with a Si interposer stacked on a CMOS chip is developed to reduce power supply impedance. A backside b... [more] SDM2020-5 ICD2020-5
pp.19-24
VLD, DC, CPSY, RECONF, CPM, ICD, IE
(Joint) [detail]
2016-11-29
09:50
Osaka Ritsumeikan University, Osaka Ibaraki Campus EMI Performance of Power Delivery Networks in 3D TSV Integration
Yuuki Araga (AIST), Makoto Nagata, Noriyuki Miura, Hiroaki Ikeda (Kobe Univ.), Katsuya Kikuchi (AIST) CPM2016-78 ICD2016-39 IE2016-73
 [more] CPM2016-78 ICD2016-39 IE2016-73
pp.11-16
ICD, MW 2016-03-02
13:40
Hiroshima Hiroshima University In-stack diagnosis of power delivery network response in 3D IC
Ranto Miura (Kobe Univ.), Yuuki Araga (AIST), Hiroaki Ikeda, Noriyuki Miura (Kobe Univ.), Katsuya Kikuchi (AIST), Makoto Nagata (Kobe Univ.) MW2015-179 ICD2015-102
 [more] MW2015-179 ICD2015-102
pp.33-36
ICD, SDM 2012-08-02
14:40
Hokkaido Sapporo Center for Gender Equality, Sapporo, Hokkaido Intra/Inter Tier Substrate Noise Measurements in 3D ICs
Yasumasa Takagi, Yuuki Araga, Makoto Nagata (Kobe Univ.), Geert Van der Plas, Jaemin Kim, Nikolaos Minas, Pol Marchal, Michael Libois, Antonio La Manna, Wenqi Zhang, Julien Ryckaert, Eric Beyne (IMEC) SDM2012-72 ICD2012-40
Substrate noise propagation among stacked dice is evaluated in a 3D test vehicle of 2 tier stacking. Each tier incorpora... [more] SDM2012-72 ICD2012-40
pp.49-54
ICD, ITE-IST 2011-07-22
10:50
Hiroshima Hiroshima Institute of Technology A Diagnosis Testbench of Analog IP Cores Against On-Chip Environmental Disturbances
Yuuki Araga, Takushi Hashida, Shinichiro Ueyama, Makoto Nagata (Kobe Univ.) ICD2011-29
Analog IP cores exhibit a multivariate response to dynamic variations of an operation environment,
that are typically r... [more]
ICD2011-29
pp.79-84
ICD, ITE-IST 2010-07-22
09:55
Osaka Josho Gakuen Osaka Center Evaluation of algorithms for waveform acquisition in on-chip multi-channel monitoring
Yuuki Araga, Takushi Hashida, Makoto Nagata (Kobe Univ.) ICD2010-22
 [more] ICD2010-22
pp.5-9
ICD 2008-12-11
13:30
Tokyo Tokyo Inst. Tech., Ohokayama Campus, Kokusa-Kouryu-Kaikan [Poster Presentation] Evaluation of algorithms for waveform acquisition in on-chip multi-channel monitoring
Yuuki Araga, Takushi Hashida, Makoto Nagata (Kobe Univ.) ICD2008-108
Multi-channel waveform monitoring system for large-scale SoCs.
The system consists of probing front end circuits and a ... [more]
ICD2008-108
pp.39-42
ICD, ITE-IST 2008-10-24
09:20
Hokkaido Hokkaido University Evaluation of algorithms for waveform acquisition in on-chip multi-channel monitoring
Yuuki Araga, Takushi Hashida, Makoto Nagata (Kobe Univ.) ICD2008-80
Multi-channel waveform monitoring system for large-scale SoCs.
The system consists of probing front end circuits and a... [more]
ICD2008-80
pp.125-130
 Results 1 - 9 of 9  /   
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