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All Technical Committee Conferences (Searched in: All Years)
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Search Results: Conference Papers |
Conference Papers (Available on Advance Programs) (Sort by: Date Descending) |
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Committee |
Date Time |
Place |
Paper Title / Authors |
Abstract |
Paper # |
EE, WPT (Joint) |
2016-10-06 16:25 |
Kyoto |
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Drive-by-Microwave(DBM) technologies for power switching devices Songbek Che, Shuichi Nagai, Noboru Negoro, Yasufumi Kawai, Osamu Tabata, Yasuhiro Yamada, Hiroaki Ueno, Tetsuzo Ueda (Panasonic AIS) EE2016-23 WPT2016-29 |
(To be available after the conference date) [more] |
EE2016-23 WPT2016-29 pp.25-30(EE), pp.55-60(WPT) |
ICD, SDM |
2012-08-03 10:05 |
Hokkaido |
Sapporo Center for Gender Equality, Sapporo, Hokkaido |
[Invited Talk]
A DC-Isolated Gate Drive IC with Drive-by-Microwave Technology Shuichi Nagai, Noboru Negoro, Takeshi Fukuda, Yasufumi Kawai, Tetsuzo Ueda, Tsuyoshi Tanaka, Nobuyuki Otsuka, Daisuke Ueda (Panasonic) SDM2012-79 ICD2012-47 |
We have developed new isolated gate drivers with the Drive-by-Microwave Technology that regenerates the gate signal afte... [more] |
SDM2012-79 ICD2012-47 pp.89-92 |
MW, ED |
2011-01-14 14:55 |
Tokyo |
Kikai-Shinko-Kaikan Bldg. |
A Wafer-Level-Chip-Size-Package Technique with Inverted Microstrip Lines for mm-wave Si CMOS ICs Yasufumi Kawai, Shinji Ujita, Takeshi Fukuda, Hiroyuki Sakai, Tetsuzo Ueda, Tsuyoshi Tanaka (Panasonic) ED2010-191 MW2010-151 |
We present a novel wafer-level-chip-size-package (WLCSP) technique with inverted microstrip line (IMSL) for mm-wave Si-C... [more] |
ED2010-191 MW2010-151 pp.87-90 |
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