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All Technical Committee Conferences (Searched in: All Years)
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Search Results: Conference Papers |
Conference Papers (Available on Advance Programs) (Sort by: Date Descending) |
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Committee |
Date Time |
Place |
Paper Title / Authors |
Abstract |
Paper # |
VLD, DC, RECONF, ICD, IPSJ-SLDM (Joint) [detail] |
2020-11-17 09:30 |
Online |
Online |
Analysis of Resistance Distribution in Chips with Inductive Coupling Wireless Communication Interface Hideto Kayashima, Hideharu Amano, Tsunaaki Shidei (Keio Univ.) VLD2020-19 ICD2020-39 DC2020-39 RECONF2020-38 |
Building Block Computing Systems, one of the 3D stacked LSI systems, use a wireless communication interface TCI (Through... [more] |
VLD2020-19 ICD2020-39 DC2020-39 RECONF2020-38 pp.48-53 |
VLD, DC, CPSY, RECONF, ICD, IE, IPSJ-SLDM, IPSJ-EMB, IPSJ-ARC (Joint) [detail] |
2019-11-15 15:20 |
Ehime |
Ehime Prefecture Gender Equality Center |
Evaluation of Inter-chip Inductive Coupling Wireless Communication Technology Hideto Kayashima, Takuya Kojima, Hayate Okuhara, Tsunaaki Shidei, Hideharu Amano (Keio Univ.) CPSY2019-48 |
Building block computing systems, which is one of the three-dimensional stacked LSI systems, use a wireless communicatio... [more] |
CPSY2019-48 pp.59-64 |
VLD, IPSJ-SLDM |
2019-05-15 15:50 |
Tokyo |
Ookayama Campus, Tokyo Institute of Technology |
The real chip evaluation of Through Chip Interface IP for Renesas 65nm SOTB process Hideharu Amano, Hideto Kayashima, Tsunaaki Shidei, Takuya Kojima (Keio Univ.) VLD2019-5 |
(To be available after the conference date) [more] |
VLD2019-5 pp.31-36 |
ICD, CPSY |
2016-12-15 10:30 |
Tokyo |
Tokyo Institute of Technology |
An Interectual Property for Wireless Inductive Coupling Through Chip Interface Yusuke Matsushita, Koichiro Masuyama, Akio Nomura, Junichiro Kadomoto, Tsunaaki Shidei, Tadahiro Kuroda, Hideharu Amano (Keio Univ.) ICD2016-52 CPSY2016-58 |
[more] |
ICD2016-52 CPSY2016-58 pp.7-12 |
SDM, ICD |
2013-08-01 14:40 |
Ishikawa |
Kanazawa University |
[Invited Talk]
A 0.15mm-Thick Non-Contact Connector for MIPI Using Vertical Directional Coupler Atsutake Kosuge, Wataru Mizuhara, Tsunaaki Shidei, Tsutomu Takeya, Noriyuki Miura, Masao Taguchi, Hiroki Ishikuro, Tadahiro Kuroda (Keio Univ.) SDM2013-72 ICD2013-54 |
The world's first 0.15-mm-thick non-contact connector for Mobile Industry Processor Interface (MIPI) applications is pre... [more] |
SDM2013-72 ICD2013-54 pp.35-40 |
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