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 Results 41 - 48 of 48 [Previous]  /   
Committee Date Time Place Paper Title / Authors Abstract Paper #
EMD 2009-12-18
13:30		 Chiba   Magnetic Pulse Welding of a Copper Sheet to Metal Pillars (Copper Bumps)
Tomokatsu Aizawa, Keigo Okagawa (Tokyo Metropolitan College), Tetsuo Machida (Nihon Multi) EMD2009-107		 This paper describes a new joining method of a copper sheet to metal pillars (copper bumps) and its experimental results... [more] EMD2009-107
pp.7-10
EMD 2009-11-19
13:20		 Tokyo Nippon Institute of Technology, Kanda Campus, Tokyo, Japan Welding of Manganin and Copper sheets by Using Magnetic Pulse Welding (MPW) Technique
Mehrdad Kashani, Tomokatsu Aizawa, Keigo Okagawa (Tokyo Metropolitan Coll. of Tech.), Yoshitaka Sugiyama (Yazaki Corp.) EMD2009-76		  [more] EMD2009-76
pp.29-31
EMD 2008-12-19
13:55		 Tokyo Tamagawa Univ. Magnetic Pulse Welding of Various Metal Foils such as Copper, Nickel, Stainless Steel
Tomokatsu Aizawa, Keigo Okagawa (Tokyo Metropolitan College. of Industrial Tech.) EMD2008-107		 This paper describes a foil welding technique by applying pulsed magnetic pressure and its experimental results for vari... [more] EMD2008-107
pp.5-10
EMD 2008-01-25
14:25		 Tokyo Kikai-Shinko-Kaikan Bldg. Joining Method through Holes between Insulated Conductors by Applying Magnetic Pressure
Tomokatsu Aizawa, Keigo Okagawa, Mehardad Kashani (Tokyo Metropolitan College) EMD2007-111		 This paper describes a new joining method through holes between insulated conductors and its experimental results. When ... [more] EMD2007-111
pp.13-16
EMD 2007-12-21
15:55		 Tokyo Japan Aviation Electronics Industry,Limited Magnetic Pressure Welding of Copper Foils on Flexible Printed Circuit Boards (2nd Report)
Tomokatsu Aizawa (Tokyo Metropolitan College), Kenichi Hanazaki (Yazaki Corporation), Keigo Okagawa (Tokyo Metropolitan College) EMD2007-106		 This paper describes a new welding technique for copper foils on
flexible printed circuit boards and its experimental r... [more]		 EMD2007-106
pp.35-38
EMD 2007-03-09
13:05		 Chiba CIT Electromagnetic Bulging of Aluminum Sheet
Hirosi Komai, Kentarou Uejima, Kouiti Watanabe, Keigo Okagawa, Tomokatsu Aizawa (College of Industrial Tech.) 		 [more] EMD2006-74
pp.1-4
EMD 2007-03-09
13:20		 Chiba CIT Calculation of High-density Magnetic Flux and Magnetic Pressure Generated by One-turn Flat Coil
Tomoya Oota, Katsunori Kimura, Keigo Okagawa, Tomokatsu Aizawa (College of Industrial Tech.) 		 [more] EMD2006-75
pp.5-8
EMD 2006-11-17
15:30		 Kanagawa Fujitsu Magnetic Pressure Welding of Copper Foils on Flexible Printed Circuit Boards
Tomokatsu Aizawa (College of Industrial Tech.), Kenichi Hanazaki (Yazaki Corporation), Keigo Okagawa (College of Industrial Tech.) 		This paper describes a new welding technique for copper foils on flexible printed circuit boards and its experimental re... [more] EMD2006-57
pp.17-20
 Results 41 - 48 of 48 [Previous]  /   
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