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All Technical Committee Conferences (Searched in: All Years)
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| Search Results: Conference Papers |
| Conference Papers (Available on Advance Programs) (Sort by: Date Descending) |
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| Committee |
Date Time |
Place |
Paper Title / Authors |
Abstract |
Paper # |
| ED, MW |
2006-01-18
13:30 |
Tokyo |
Kikai-Shinko-Kaikan Bldg. |
A Low-Phase-Noise 76-GHz Planar Gunn VCO Using Flip-Chip Bonding Technology
Takashi Yoshida, Yoshimichi Fukasawa, Tadayoshi Deguchi, Kiyoshi Kawaguchi, Takahiro Sugiyama, Atsushi Nakagawa (New Japan Radio) |
A low-phase-noise76-GHz planar Gunn VCO using flip-chip bonding technology has been developed. The power consumption is ... [more] |
ED2005-192 MW2005-146
pp.1-5 |
| CPM |
2005-11-11
16:40 |
Fukui |
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Characterization of the surface layer on high-Tc superconducting Bi2Sr2CaCu2Ox single crystal modified with dilute hydrohloric asid
Naomi Yokawa, Takashi Yoshida, Kumi Okanoue, Hisayuki Suematsu, Katsuyoshi Hamasaki (Nagaoka Univ. of Tech.), Takeshi Terajima, Hiroya Abe (JWRI, Osaka Univ.) |
We have developed special technique to fabricate intrinsic Josephson devices built from high-Tc Bi$_{2}$Sr$_{2}$CaCu$_{2... [more] |
CPM2005-159
pp.39-43 |
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