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Committee Date Time Place Paper Title / Authors Abstract Paper #
LQE, OPE, EMD, R, CPM 2016-08-26
14:35		 Hokkaido   Equalizer-free 100-Gbit/s/λ signal transmission using flip-chip interconnection EADFB laser module
Shigeru Kanazawa, Satoshi Tsunashima, Yasuhiko Nakanishi, Yoshifumi Muramoto, Hiroshi Yamazaki, Yuta Ueda, Wataru Kobayashi, Hiroyuki Ishii, Hiromasa Tanobe, Hiroaki Sanjoh (NTT) 		 [more]
ED, MW 2014-01-17
13:55		 Tokyo Kikai-Shinko-Kaikan Bldg. Low-Power, Linear Driver Module for InP MZM
Hitoshi Wakita, Munehiko Nagatani, Miwa Mutoh, Satoshi Tsunashima, Hiroyuki Fukuyama, Hideyuki Nosaka, Norihide Kashio, Minoru Ida, Kenji Kurishima (NTT) ED2013-130 MW2013-195		 In this paper, the characteristics of InP MZM driver module are presented. The linear driver IC that was implemented in... [more] ED2013-130 MW2013-195
pp.115-120
ED, SDM 2010-06-30
16:30		 Tokyo Tokyo Inst. of Tech. Ookayama Campus 50-Gbit/s MUX/DEMUX IC modules using feed-trough type metal-wall package technique
Satoshi Tsunashima, Michihiro Hirata, Koichi Murata (NTT Corp.) ED2010-72 SDM2010-73		 A broadband metal-wall (MW) package that uses a feed-through RF interface has been developed for 50-Gbit/s multiplexer (... [more] ED2010-72 SDM2010-73
pp.91-96
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