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All Technical Committee Conferences (Searched in: All Years)
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Search Results: Conference Papers |
Conference Papers (Available on Advance Programs) (Sort by: Date Descending) |
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Committee |
Date Time |
Place |
Paper Title / Authors |
Abstract |
Paper # |
SDM |
2011-02-07 12:40 |
Tokyo |
Kikai-Shinko-Kaikan Bldg. |
A highly reliable Cu interconnect with CuSiN and Ti-based barrier metal: Impact of oxgen surface treatment Yumi Hayashi, Noriaki Matsunaga, Makoto Wada, Shinichi Nakao, Kei Watanabe, Satoshi Kato, Atsuko Sakata, Akihiro Kajita, Hideki Shibata (Toshiba Corp.) SDM2010-219 |
A trade-off property of CuSiN between EM improvement and line resistance increase was resolved by a breakthrough that le... [more] |
SDM2010-219 pp.19-23 |
SDM |
2010-02-05 14:00 |
Tokyo |
Kikai-Shinko-Kaikan Bldg. |
Low resistive and highly reliable copper interconnects in combination of silicide-cap with Ti-barrier for 32 nm-node and beyond Yumi Hayashi, Noriaki Matsunaga, Makoto Wada, Shinichi Nakao, Atsuko Sakata, Kei Watanabe, Hideki Shibata (Toshiba) SDM2009-187 |
Silicide-cap for Cu interconnects is promising for enhancing electromigration (EM) performance for 32 nm-node and beyond... [more] |
SDM2009-187 pp.31-36 |
SDM |
2009-11-13 11:15 |
Tokyo |
Kikai-Shinko-Kaikan Bldg. |
A Novel Monte Carlo Simulation to Evaluate the Size Effect of Resistivity for Scaled Metallic Interconnects Takashi Kurusu, Makoto Wada, Noriaki Matsunaga, Akihiro Kajita, Hiroyoshi Tanimoto, Nobutoshi Aoki, Yoshiaki Toyoshima, Hideki Shibata (Toshiba Corp.) SDM2009-145 |
Recently, the size effect on resistivity in very narrow and thin metallic wires is a crucial problem on development of s... [more] |
SDM2009-145 pp.55-60 |
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