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 Conference Papers (Available on Advance Programs)  (Sort by: Date Descending)
 Results 1 - 5 of 5  /   
Committee Date Time Place Paper Title / Authors Abstract Paper #
MW, WPT 2018-04-27
14:50		 Tokyo Kikai-Shinko-Kaikan Building S-band Tx Module with Cu Pillar Interconnection Si/GaN 3D Chip Embedding Substrate
Kengo Kawasaki, Eigo Kuwata, Hidenori Ishibashi, Tomohiro Yao, Kiyoshi Ishida, Kazuhiro Maeda, Hironobu Shibata, Masaomi Tsuru, Kazutomi Mori, Mitsuhiro Shimozawa, Hiroshi Fukumoto (Mitsubishi Electric Corp.) WPT2018-5 MW2018-5		 A SiGe chip and GaN chip packaged Tx module in S-band is represented. SiGe and GaN with Redistribution Layer (RDL) are i... [more] WPT2018-5 MW2018-5
pp.19-23
MW 2016-01-14
14:45		 Tokyo Kikai-Shinko-Kaikan Bldg. Leadframe Type Semiconductor Packages with Electro-Magnetic Shield Structure
Hiroyuki Mizutani, Hidenori Ishibashi, Kiyoshi Ishida, Yousuke Watanabe, Morishige Hieda (Mitsubishi Electric) MW2015-162		  [more] MW2015-162
pp.17-20
IN 2012-10-10
15:50		 Tokyo Tokyo Univ. Sanjo-Kaikan DYPOP: Datacenter beside Your POP -- Distributed network service infrastructure on access network --
Katsushi Kobayashi (AICS), Kazuyuki Shudo (TITECH), Kiyoshi Ishida, Shigeru Yamamoto, Takashi Sogabe (IIJ) IN2012-80		 (To be available after the conference date) [more] IN2012-80
pp.35-38
CQ 2012-07-13
15:00		 Ehime Ehime Univ. Datacenter beside Your telco-POP for Large-scale Contents Distribution System
Shigeru Yamamoto, Kiyoshi Ishida, Takashi Sogabe (IIJ), Katsushi Kobayashi (RIKEN), Kazuyuki Shudo (Tokyo Tech) CQ2012-39		 We are developing Micro-Datacenter on TELCO-POP to utilize broadband and stable access circuit infrastructure, such as F... [more] CQ2012-39
pp.131-135
IA 2011-10-12
16:25		 Tokyo Garden City Shinagawa Micro-Data Center on TELCO-POP for distributed network service infrastructure -- none --
Katsushi Kobayashi (RIKEN), Kazuyuki Shudo (TITECH), Kiyoshi Ishida, Shigeru Yamamoto, Takashi Sogabe (IIJ) IA2011-23		 We are developing Micro-Data Center on TELCO-POP to utilize broadband and stable access circuit infrastructure, such as ... [more] IA2011-23
pp.33-37
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