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 Conference Papers (Available on Advance Programs)  (Sort by: Date Descending)
 Results 1 - 6 of 6  /   
Committee Date Time Place Paper Title / Authors Abstract Paper #
UWT
(2nd)		 2022-03-01
14:05		 Online Online Formulation and Validation of the Transmission Factor Between Two Electrically Small Dipole Antennas Immersed in Seawater
Takashi Kawamura, Takuma Matsushita, Toshinori Kondo, Futoshi Takeuchi, Kazuhiro Hongo, Yasuhiro Matsui, Takashi Takinami, Akihiro Horii, Kazunobu Ohkuri (Sony Group) 		As one of the theoretical approaches to reveal antenna behavior in the sea, it has been reported that the impedances of ... [more]
WPT, UWT
(Joint)		 2021-11-12
14:45		 Online Online Formulation, Validation, and Extensibility Study on the Impedance of Underwater Dipole Antennas
Takuma Matsushita, Takashi Kawamura, Toshinori Kondo, Futoshi Takeuchi, Yasuhiro Matsui, Takashi Takinami, Kazuhiro Hongo, Akihiro Horii, Kazunobu Ohkuri (Sony Group Corp.) 		This paper describes the theoretical formulation for half sheath dipole antenna(HSDA) and adaption area of this formulat... [more]
MW 2008-11-21
15:00		 Nagasaki Nagasaki-Univ. Broadband Suspended-Coupled Balun for 5GHz Band Using Multi-Layer Liquid Crystal Polymer Substrate
Satoshi Yoshida, Futoshi Takeuchi, Suguru Kameda, Tadashi Takagi, Kazuo Tsubouchi (Tohoku Univ.) MW2008-143		 We redesigned a new ground pattern of suspended-coupled balun using multilayer interconnection structure, and incresed b... [more] MW2008-143
pp.143-148
MW 2007-05-22
11:15		 Hyogo University of Hyogo Suspended Coupled Balun for Microwave Band Using Multi-Layer Liquid Crystal Polymer Substrate
Futoshi Takeuchi, Suguru Kameda, Hiroyuki Nakase, Tadashi Takagi, Kazuo Tsubouchi (Tohoku Univ.) MW2007-24		 This paper presents a suitable structure of a balun using a multi-layer substrate. In a conventional planar balun, it is... [more] MW2007-24
pp.67-72
MW 2006-09-05
15:00		 Tokyo   -
Futoshi Takeuchi, Kohei Masuda, Takuo Yoshida, Suguru Kameda, Hiroyuki Nakase, Tadashi Takagi, Kazuo Tsubouchi (Tohoku Univ.) 		The high frequency electrical characteristics of Cu ball bonding between layered boards were considered for a 3-dimensio... [more] MW2006-83
pp.47-52
MW 2006-06-27
11:20		 Aichi   60GHz Subharmonic Mixer Module Using Stud Bump Bonding Technology
Kohei Masuda, Futoshi Takeuchi (Tohoku Univ.), Yasuhiro Hamada, Kenichi Maruhashi (NEC), Hiroshi Oguma, Suguru Kameda, Hiroyuki Nakase, Tadashi Takagi, Kazuo Tsubouchi (Tohoku Univ.) 		60-GHz band is expected to be used for wireless personal area network with a data rate of more than 3Gbit/s. We are aim... [more] MW2006-27
pp.11-16
 Results 1 - 6 of 6  /   
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