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All Technical Committee Conferences (Searched in: All Years)
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Search Results: Conference Papers |
Conference Papers (Available on Advance Programs) (Sort by: Date Descending) |
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Committee |
Date Time |
Place |
Paper Title / Authors |
Abstract |
Paper # |
EMCJ, MW, EST, IEE-EMC [detail] |
2019-10-25 15:55 |
Miyagi |
Tohoku Gakuin University(Conf. Room 2, Eng. Bldg. 1) |
Noise Suppression with Magnetic Composite Sheets in IC chip packaging and Improvements of Wireless Communication Performance Koh Watanabe, Kosuke Jike, Satoshi Tanaka, Noriyuki Miura, Makoto Nagata (Kobe Univ.), Akihiro Takahashi, Yasunori Miyazawa, Masahiro Yamaguchi (Tohoku Univ.) EMCJ2019-67 MW2019-96 EST2019-75 |
Magnetic composite sheets of ferrite powders were newly packaged between an IC chip and an interposer substrate as a new... [more] |
EMCJ2019-67 MW2019-96 EST2019-75 pp.175-178 |
SDM, ICD, ITE-IST [detail] |
2019-08-09 12:00 |
Hokkaido |
Hokkaido Univ., Graduate School /Faculty of Information Science and |
Evaluation of IC-Chip Noise Reduction using Magnetic Materials Kosuke Jike, Koh Watanabe, Satoshi Tanaka, Noriyuki Miura, Makoto Nagata (Kobe Univ), Akihiro Takahashi, Yasunori Miyazawa, Masahiro Yamaguchi (Tohoku Univ) SDM2019-49 ICD2019-14 |
Suppression of noise emitted from digital integrated circuit (IC) chip is expected by using magnetic materials. The freq... [more] |
SDM2019-49 ICD2019-14 pp.79-83 |
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