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All Technical Committee Conferences (Searched in: All Years)
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Search Results: Conference Papers |
Conference Papers (Available on Advance Programs) (Sort by: Date Descending) |
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Committee |
Date Time |
Place |
Paper Title / Authors |
Abstract |
Paper # |
CPM, ICD |
2008-01-18 14:15 |
Tokyo |
Kikai-Shinko-Kaikan Bldg |
Assessment Test for Solder Joint Reliability in Mobile Products Masazumi Amagai, Hiroyuki Sano (TI Japan) CPM2007-144 ICD2007-155 |
When a mobile phone is dropped, the frequency of occurrence of cracks in solder joints is high. Voids in intermetallic ... [more] |
CPM2007-144 ICD2007-155 pp.93-98 |
ICD, CPM |
2007-01-19 09:50 |
Tokyo |
Kika-Shinko-Kaikan Bldg. |
Modeling of Wire Bonding Process for High Performance Device Eiichi Yamada, Masazumi Amagai (TI Japan) |
[more] |
CPM2006-143 ICD2006-185 pp.83-86 |
ICD, CPM |
2007-01-19 10:15 |
Tokyo |
Kika-Shinko-Kaikan Bldg. |
Signal Transmission Guideline in IC Package Kentaro Takao, Chikara Azuma, Masazumi Amagai (TIJ) |
[more] |
CPM2006-144 ICD2006-186 pp.87-90 |
ICD, CPM |
2005-09-08 13:50 |
Tokyo |
Kikai-Shinko-Kaikan Bldg. |
The Study of Silicon Stress for Stacked Die Packages Kenji Abe, Eiichi Yamada, Yutaka Suzuki, Masazumi Amagai (TI Japan) |
[more] |
CPM2005-92 ICD2005-102 pp.41-44 |
ICD, CPM |
2005-09-08 14:30 |
Tokyo |
Kikai-Shinko-Kaikan Bldg. |
The Study of Stress Sensor for Stacked Die Packages Yutaka Suzuki, Kenji Abe, Eiichi Yamada, , Masazumi Amagai (TI Japan) |
[more] |
CPM2005-93 ICD2005-103 pp.45-48 |
ICD, CPM |
2005-01-27 16:45 |
Tokyo |
Kikai-Shinko-Kaikan Bldg. |
The Study of An-Ag-X Lead Free Solders for High Reliability Masazumi Amagai (TI Japan), Tsukasa Ohnishi, (SMI) |
[more] |
CPM2004-161 ICD2004-206 pp.35-38 |
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