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All Technical Committee Conferences (Searched in: All Years)
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Search Results: Conference Papers |
Conference Papers (Available on Advance Programs) (Sort by: Date Descending) |
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Committee |
Date Time |
Place |
Paper Title / Authors |
Abstract |
Paper # |
SDM |
2012-03-05 15:25 |
Tokyo |
Kikai-Shinko-Kaikan Bldg. |
Influence of Via Stress on Surface Micro-roughness-induced Leakage Current in Through-Silicon Via Interconnects Hideki Kitada (Univ. of Tokyo/Fujitsu Lab.), Nobuhide Maeda, Koji Fujimoto, Shoichi Kodama, Young Suk Kim (Univ. of Tokyo), Yoriko Mizushima (Univ. of Tokyo/Fujitsu Lab.), Tomoji Nakamura (Fujitsu Lab.), Takayuki Ohba (Univ. of Tokyo) SDM2011-183 |
[more] |
SDM2011-183 pp.41-46 |
SDM |
2012-03-05 15:55 |
Tokyo |
Kikai-Shinko-Kaikan Bldg. |
Characterization of Local Strain around Through Silicon Via Interconnect in Wafer-on-wafer Structures Osamu Nakatsuka (Nagoya Univ.), Hideki Kitada, Young Suk Kim (Univ. of Tokyo), Yoriko Mizushima, Tomoji Nakamura (Fujitsu Lab.), Takayuki Ohba (Univ. of Tokyo), Shigeaki Zaima (Nagoya Univ.) SDM2011-184 |
We have investigated the local strain structure in a thinned Si layer stacked on Si substrate for wafer-on-a-wafer appli... [more] |
SDM2011-184 pp.47-52 |
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