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Committee Date Time Place Paper Title / Authors Abstract Paper #
SDM 2008-03-14
15:25		 Tokyo Kikai-Shinko-Kaikan Bldg. Through-silicon Via Interconnection for 3D Integration Using Room-temperature Bonding
Naotaka Tanaka, Yasuhiro Yoshimura, Michihiro Kawashita (Hitachi), Toshihide Uematsu, Takahiro Naitoh, Takashi Akazawa (Renesas) SDM2007-277		 One approach to 3D technology is chip stacking using through-silicon vias (TSVs). Interconnects in a 3D assembly are pot... [more] SDM2007-277
pp.21-26
ICD, CPM 2005-09-08
13:00		 Tokyo Kikai-Shinko-Kaikan Bldg. System Packaging Issue and Solution of Renesas SiP
Noriaki Sakamoto, Norihiko Sugita, Takafumi Kikuchi, Hideki Tanaka, Takashi Akazawa (ルネサステクノロジ) 		 [more] CPM2005-90 ICD2005-100
pp.31-34
ICD 2005-04-14
19:00		 Fukuoka   *
Katsuyuki Sato (Elpida), Hiroyuki Yamauchi (Matsushita), Kenji Numata (Toshiba), Takashi Akazawa (Renesas), Yasunao Katayama (IBM Japan) 		 [more] ICD2005-12
p.59
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