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 Conference Papers (Available on Advance Programs)  (Sort by: Date Descending)
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Committee Date Time Place Paper Title / Authors Abstract Paper #
ICD, SDM, ITE-IST [detail] 2022-08-08
15:20		 Online   Evaluation of IC Chip Response by Backside Voltage Disturbance in Flip Chip Packaging
Takuya Wadatsumi, Kohei Kawai, Rikuu Hasegawa (Kobe Univ.), Kikuo Muramatsu (e-SYNC), Hiromu Hasegawa, Takuya Sawada, Takahito Fukushima, Hisashi Kondo (Megachips), Takuji Miki, Makoto Nagata (Kobe Univ.) SDM2022-40 ICD2022-8		 Flip chip packaging has become a general technique for mounting semiconductor ICs due to the need for smaller area. Howe... [more] SDM2022-40 ICD2022-8
pp.27-30
SDM 2016-01-22
15:25		 Tokyo Sanjo Conference Hall, The University of Tokyo [Invited Talk] Novel reconfigured wafer-to-wafer(W2W) hybrid bonding technology using ultra-high density nano-Cu filaments for exascale 2.5D/3D integration
Kangwook Lee, Taksfumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi (Tohoku Univ.) SDM2015-117		  [more] SDM2015-117
pp.39-43
MSS, SS 2015-01-26
14:45		 Tottori   Just-In-Time Defect Prediction Tool anko
Shutaro Tanaka, Takafumi Fukushima, Kazuhiro Yamashita, Yasutaka Kamei, Naoyasu Ubayashi (Kyushu Univ.) MSS2014-72 SS2014-36		 Some previous studies show that defect prediction at the change-level (i.e., defect prediction for a commit to version c... [more] MSS2014-72 SS2014-36
pp.19-24
ICD, SDM 2008-07-18
15:05		 Tokyo Kikai-Shinko-Kaikan Bldg. Impact of Tantalum Composition in TaCx/HfSiON Gate Stack on Device Performance of Aggressively Scaled CMOS Devices with SMT and Strained CESL
Masakazu Goto, Kosuke Tatsumura, Shigeru Kawanaka, Kazuaki Nakajima, Reika Ichihara, Yasuhito Yoshimizu, Hiroyuki Onoda, Koji Nagatomo, Toshiyuki Sasaki, Takashi Fukushima, Akiko Nomachi, Seiji Inumiya, Tomonori Aoyama, Masato Koyama, Yoshiaki Toyoshima (Toshiba Corp.) SDM2008-147 ICD2008-57		 We report TaCx/HfSiON gate stack CMOS device with simplified gate 1st process from the viewpoints of fixed charge genera... [more] SDM2008-147 ICD2008-57
pp.109-114
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