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 Conference Papers (Available on Advance Programs)  (Sort by: Date Descending)
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Committee Date Time Place Paper Title / Authors Abstract Paper #
EMCJ, MICT
(Joint)		 2024-03-15
15:45		 Shimane   Improvement of power durability in transparent electromagnetic shields with multi-layered conductive sheets
Hidetoshi Makimura, Yuta Sugiyama, Kengo Nishimoto, Yoshio Inasawa (Mitsubishi Electric Corp.) EMCJ2023-108		  [more] EMCJ2023-108
pp.23-28
WPT, MW 2023-04-13
14:45		 Tokyo Kikai-Shinko-Kaikan Bldg.
(Primary: On-site, Secondary: Online)		 Design and Evaluation of Small 4-way Power Combiner using One Waveguide
Yuta Sugiyama, Takeshi Oshima, Hidenori Ishibashi, Miki Kagano, Hidenori Yukawa, Toru Fukasawa, Yoshio Inasawa (Mitsubishi Electric) WPT2023-4 MW2023-4		 High power HPAs made of GaN are beginning to be widely used for 5G and satellite communications. Maximum output power of... [more] WPT2023-4 MW2023-4
pp.16-21
MW 2022-03-03
09:35		 Online Online Chip Resistors for Heat Dissipation on RF circuits
Yuta Sugiyama, Hidenori Ishibashi, Takeshi Oshima, Hidenori Yukawa, Toru Fukasawa, Toru Takahashi, Yoshio Inasawa (Mitsubishi Electric) MW2021-112		 In this paper we present that the technology of heat dissipation for RF circuit using chip resistors. The quarter wavele... [more] MW2021-112
pp.7-11
MW 2021-03-05
15:20		 Online Online RF circuit combined inkjet-printed silver wire and copper foil wire
Yuta Sugiyama, Hidenori Ishibashi, Takeshi Oshima, Toru Takahashi, Yoshio Inasawa (Mitsubishi Electric), Hikaru Harada (Kishu Giken Kogyo) MW2020-99		 In this paper we present RF circuit combined inkjet-printed silver wiring and copper foil wiring. Since the inkjet print... [more] MW2020-99
pp.43-48
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