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 Conference Papers (Available on Advance Programs)  (Sort by: Date Descending)
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Committee Date Time Place Paper Title / Authors Abstract Paper #
ED, CPM, LQE 2021-11-25
15:25		 Online Online Optical characterization of c-plane Al0.83In0.17N/GaN lattice-matched heterostructures
Liyang Li, Kohei Shima (Tohoku Univ.), Mizuki Yamanaka (Nagoya Inst. Tech.), Kazunobu Kojima (Tohoku Univ.), Takashi Egawa (Nagoya Inst. Tech.), Akira Uedono (Univ. of Tsukuba), Ishibashi Shoji (AIST), Tetsuya Takeuchi (Meijo Univ.), Makoto Miyoshi (Nagoya Inst. Tech.), Shigefusa Chichibu (Tohoku Univ.) ED2021-24 CPM2021-58 LQE2021-36		 Room-temperature (RT) time-resolved photoluminescence (PL) and spatially resolved cathodoluminescence (CL) measurements ... [more] ED2021-24 CPM2021-58 LQE2021-36
pp.45-50
SDM 2015-03-02
15:25		 Tokyo Kikai-Shinko-Kaikan Bldg [Invited Talk] Sub-nanoscale Structure and Barrier Performance of CVD-Cu(Mn)/ALD-Co(W) Interconnect System Proved Using 3D Atom Probe
Kohei Shima (The Univ. of Tokyo), Yuan Tu, Bin Han, Hisashi Takamizawa (Tohoku Univ.), Hideharu Shimizu (The Univ. of Tokyo), Yasuo Shimizu (Tohoku Univ.), Takeshi Momose (The Univ. of Tokyo), Koji Inoue, Yasuyoshi Nagai (Tohoku Univ.), Yukihiro Shimogaki (The Univ. of Tokyo) SDM2014-169		 We propose new materials system of a single layered Co(W) barrier/liner layer coupled with a Cu(Mn) alloy seed layer for... [more] SDM2014-169
pp.39-44
SDM 2012-03-05
13:30		 Tokyo Kikai-Shinko-Kaikan Bldg. Single-layered barrier/liner Co(W) by ALD/CVD for next generation ULSI-Cu interconnect
Hideharu Shimizu (Taiyo Nippon Sanso/Tokyo Univ.), Kohei Shima, Takeshi Momose (Tokyo Univ.), Yoshihiko Kobayashi (Taiyo Nippon Sanso), Yukihiro Shimogaki (Tokyo Univ.) SDM2011-180		 The effective resistivity of interconnects are predicted to be increased by ULSI shrinking. Barrier/liner layer formed o... [more] SDM2011-180
pp.25-29
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