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 Conference Papers (Available on Advance Programs)  (Sort by: Date Descending)
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Committee Date Time Place Paper Title / Authors Abstract Paper #
SDM 2023-02-07
10:45		 Tokyo Tokyo Univ.
(Primary: On-site, Secondary: Online)		 [Invited Talk] Atomic Layer and Conformal Etching Technologies of 3D Structures in Advanced Logic and Memory Devices
Hiroto Ohtake (Hitachi High-Tech Corp.) SDM2022-86		 Isotropic atomic layer etching (ALE) has become essential technology for the fabrication of logic transistors beyond 2nm... [more] SDM2022-86
pp.5-8
IE, CS, IPSJ-AVM, ITE-BCT [detail] 2016-12-08
15:45		 Ishikawa   [Invited Talk]
Hiroshi Ohtake (NHK) CS2016-53 IE2016-89		 (To be available after the conference date) [more] CS2016-53 IE2016-89
p.45
LQE, LSJ 2015-05-22
11:25		 Ishikawa   High Sensitivity Image Sensor Overlaid with Thin-Film Crystalline Selenium/Gallium Oxide Heterojunction Photodiode
Shigeyuki Imura, Kenji Kikuchi, Kazunori Miyakawa, Hiroshi Ohtake, Misao Kubota (NHK), Tokio Nakada (TUS), Toru Okino, Yutaka Hirose, Yoshihisa Kato (Panasonic), Nobukazu Teranishi (University of Hyogo) LQE2015-13		 We have developed an stacked image sensor using a thin-film crystalline selenium (c-Se) as a photoconversion layer. The ... [more] LQE2015-13
pp.63-67
SDM 2015-01-27
14:25		 Tokyo Kikai-Shinko-Kaikan Bldg. [Invited Talk] Three-Dimensional Integrated CMOS Image Sensors with Pixel-Parallel A/D Converters Fabricated by Direct Bonding of SOI Layers
Masahide Goto, Kei Hagiwara, Yoshinori Iguchi, Hiroshi Ohtake (NHK), Takuya Saraya, Masaharu Kobayashi, Eiji Higurashi, Hiroshi Toshiyoshi, Toshiro Hiramoto (The Univ. of Tokyo) SDM2014-141		 We report the first demonstration of three-dimensional (3D) integrated CMOS image sensors with pixel-parallel A/D conver... [more] SDM2014-141
pp.25-28
 Results 1 - 4 of 4  /   
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