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 Conference Papers (Available on Advance Programs)  (Sort by: Date Descending)
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Committee Date Time Place Paper Title / Authors Abstract Paper #
WPT, AP
(Joint)		 2019-01-17
13:35		 Aichi Toyota Automobile Museum [Invited Lecture] Near-field Wireless Power Transfer for Small Model Vehicle using Collinear Array Antenna
Jun Deguchi, Kazuhiro Yoshikawa, Hiroshi Hirayama (Nagoya Inst. of Tech.) WPT2018-55		  [more] WPT2018-55
pp.7-12
SANE 2013-06-21
16:25		 Ibaraki Tsukuba Space Center, JAXA PPP experiments via QZSS-LEX
Kazuhiro Yoshikawa, Kaori Kawate, Motoyuki Miyoshi, Satoshi Kogure (JAXA), Tatsinori Sada (NU), Tomoji Takasu (Tokyo Univ. of Marine Science and Tech.), Yasutaka Hirahara (NEC) SANE2013-33		 QZS-1 “MICHIBIKI” was launched in September 11th 2010 by H-IIA launch vehicle Flight 18th, and verification of QZSS (Qua... [more] SANE2013-33
pp.103-108
SDM 2012-10-26
13:50		 Miyagi Tohoku Univ. (Niche) Ultra high speed wet etching technology for a silicon wafer process
Takeshi Sakai, Tatsuro Yoshida, Kazuhiro Yoshikawa, Tadahiro Ohmi (Tohoku Univ.) SDM2012-97		 The silicon wafer thinning technology is important in three-dimensional integrated technology. In this paper, we conside... [more] SDM2012-97
pp.41-45
SDM 2011-10-21
16:15		 Miyagi Tohoku Univ. (Niche) Silicon Wafer Wet Etching for Plug Protrusion of 3D chip-stacking technology with Through Silicon Via
Kazuhiro Yoshikawa (PretechAT), Tatsuro Yoshida, Kazuki Soeda, Ryousuke Hiratuka, Tadahiro Ohmi (Tohoku Univ.) SDM2011-114		  [more] SDM2011-114
pp.97-100
SDM 2009-10-29
15:30		 Miyagi Tohoku University Silicon Wafer Thinning Technology for Three-Dimensional Integrated Circuit by Wet Etching
Kazuhiro Yoshikawa, Tomotsugu Ohashi, Tatsuro Yoshida, Takenao Nemoto, Tadahiro Ohmi (Tohoku Univ.) SDM2009-120		 A three-dimensional integrated circuit is developed as an emerging technology in a semiconductor industry. The silicon w... [more] SDM2009-120
pp.15-19
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