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All Technical Committee Conferences (Searched in: All Years)
| Committee | Date Time | Place | Paper Title / Authors | Abstract | Paper # | |
| VLD, DC, IPSJ-SLDM, CPSY, RECONF, ICD, CPM (Joint) [detail] |
2010-12-01 13:15 |
Fukuoka | Kyushu University | [Invited Talk]
Monolithic 3D-FPGA with TFT SRAM over 90nm 9 layer Cu CMOS Tatasuya Naito, Tatsuya Ishida (Toshiba), Takeshi Onoduka (Covalent Materials), Masahito Nishigoori, Takeo Nakayama, Yoshihiro Ueno, Yasumi Ishimoto, Akihiro Suzuki, Chung Weicheng (Toshiba), Raminda Madurawe (readyASIC), Sheldon Wu (China International Intellectual Property Services), Shu Ikeda (tei Solutions), Hisato Oyamatsu (Toshiba)  RECONF2010-50 |
[more] | RECONF2010-50 pp.65-69 |
| ICD, SDM | 2009-07-16 15:50 |
Tokyo | Tokyo Institute of Technology | The Study of Mobility-Tinv Trade-off in Deeply Scaled High-k/Metal Gate Devices and Scaling Design Guideline for 22nm-node Generation Masakazu Goto, Shigeru Kawanaka, Seiji Inumiya, Naoki Kusunoki, Masumi Saitoh, Kosuke Tatsumura, Atsuhiro Kinoshita, Satoshi Inaba, Yoshiaki Toyoshima (Toshiba) SDM2009-107 ICD2009-23 |
The trade-off between Tinv scaling and carrier mobility () degradation in deeply scaled HK/MG nMOSFETs has been ... [more] | SDM2009-107 ICD2009-23 pp.53-56 |
| SDM | 2008-10-10 15:45 |
Miyagi | Tohoku Univ. | Influence of B and P dopants on SiO2 film characteristics Satoshi Nagashima, Hiroshi Akahori (Toshiba) SDM2008-166 |
In general, the silicon material that has doped impurities such as phosphorus, boron, and arsenic to the diffusion and t... [more] | SDM2008-166 pp.63-68 |
| SDM | 2006-06-22 10:55 |
Hiroshima | Faculty Club, Hiroshima Univ. | Realization of SiON films with small ΔVfb Daisuke Matsushita, Koichi Muraoka, Yasushi Nakasaki, Koichi Kato, Shoko Kikuchi, Kiwamu Sakuma, Yuichiro Mitani (toshiba R&D center), Mariko Takayanagi, Kazuhiro Eguchi (Semiconductor Company) |
[more] | SDM2006-56 pp.81-86 |
| ICD | 2005-12-16 14:25 |
Kochi | A 1.2-V CMOS Complex Bandpass Filter with a Tunable Center Frequency Hideaki Majima, Hiroki Ishikuro, Kenichi Agawa, Mototsugu Hamada (Toshiba Corp.) |
[more] | ICD2005-202 pp.61-66 |
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| ICD, CPM | 2005-09-09 10:55 |
Tokyo | Kikai-Shinko-Kaikan Bldg. | Lead-free bumping and its process integrity for fine pitch interconnects Hirokazu Ezawa, Masaharu Seto, Kazuhito Higuchi (Toshiba) |
Electroplated solder bumps allow much finer pitch interconnection for high I/O applications, although controlling the al... [more] | CPM2005-99 ICD2005-109 pp.17-22 |
| EA | 2005-06-24 15:50 |
Saitama | 1 bit Wavefield Recording/Reproduction System using Electrostatic Microphone and Loudspeaker Shigeto Takeoka, Makoto Kurihara, Masanori Okazaki, Yasuhiro Oikawa (Waseda Univ.), Meisei Nishikawa (TOSHIBA), Yoshio Yamasaki (Waseda Univ.) |
[more] | EA2005-24 pp.25-30 |
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