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 Conference Papers (Available on Advance Programs)  (Sort by: Date Descending)
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Committee Date Time Place Paper Title / Authors Abstract Paper #
CPM 2020-10-29
14:00		 Online Online Mechanism of Cu(111) orientation control on extremely thin barrier
Mayumi B. Takeyama (Kitami Inst.& Technol.), Mitsunobu Yasuda (Toray Research Center.), Masaru Sato (Kitami Inst.& Technol.) CPM2020-14		 In Si-LSI and/or 3D-LSI technology, it is strongly desired to obtain Cu(111) orientation with excellent electromigration... [more] CPM2020-14
pp.11-14
SDM 2014-02-28
11:00		 Tokyo Kikai-Shinko-Kaikan Bldg. [Invited Talk] Impact of Back Grind Damage on Si Wafer Thinning for 3D Integration
Yoriko Mizushima (Fujitsu Lab./Tokyo Inst. of Tech.), Youngsuk Kim (Tokyo Inst. of Tech./Disco), Tomoji Nakamura (Fujitsu Lab.), Ryuichi Sugie, Hideki Hashimoto (Toray Research Center), Akira Uedono (Univ. of Tsukuba), Takayuki Ohba (Tokyo Inst. of Tech.) SDM2013-167		 Ultra-thin wafer is indispensable for bumpless 3D stacking. To know the thinning damage in detail, an atomic level defec... [more] SDM2013-167
pp.13-18
R 2009-06-19
13:00		 Tokyo Kikai-Shinko-Kaikan Bldg. Observations and analyses on device structures for reliability of IC/LSI
Tsuneo Ajioka, Sumihisa Ishikawa, Keiichi Yamada (Toray Reaserch Center) R2009-17		  [more] R2009-17
pp.1-6
ED 2008-10-23
13:00		 Fukuoka Kyushu Institute of Technology Crystalline Recovery and Point Defects Re-arrangement during Activation Annealing of Implanted SiC Crystal
Ryo Hattori, Tomokatsu Watanabe, Hiroaki Sumitani, Tatsuo Oomori (Mitsubishi Electric Corp.), Takeshi Mitani (TRC) ED2008-146		  [more] ED2008-146
pp.127-132
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