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Technical Committee on Silicon Device and Materials (SDM) [schedule] [select]
Chair Tatsuya Kunikiyo (Renesas)
Vice Chair Takahiro Shinada (Tohoku Univ.)
Secretary Rihito Kuroda (Tohoku Univ.), Tadashi Yamaguchi (Renesas)
Assistant Hiroya Ikeda (Shizuoka Univ.)

Conference Date Mon, Feb 6, 2017 10:05 - 16:45
Topics Interconnects, Package and related materials 
Conference Place  
Sponsors This conference is co-sponsored by The Japan Society of Applied Physics.
All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (No. 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034)

Mon, Feb 6 AM 
10:00 - 16:45
  10:00-10:05 Opening ( 5 min. )
(1) 10:05-10:40 [Invited Talk]
Impact of Dry Process Damage on Chemical Mechanical Planarization with Cu/low-k Structure SDM2016-139
Masako Kodera, Hiroyuki Yano, Naoto Miyashita (Toshiba)
(2) 10:40-11:15 [Invited Talk]
Fabrication of High-Quality Metalic Films for ULSI by ALD SDM2016-140
Yukihiro Shimogaki (UTokyo)
(3) 11:15-11:50 [Invited Talk]
NiGe/Ge contact formation by microwave annealing method for low-thermal budget processing SDM2016-141
Osamu Nakatsuka (Grad. Sch. of Eng., Nagoya University), Yoshimasa Watanabe (TEL), Akihiro Suzuki (Grad. Sch. of Eng., Nagoya University), Yoshio Nishi (Dept. of Electrical Engineering, Stanford University), Shigeaki Zaima (IMaSS, Nagoya University)
  11:50-13:00 Lunch ( 70 min. )
(4) 13:00-13:35 [Invited Talk]
Huge-potential need to the memory-system for ultra-long term preservation and its issues
-- Development of the WASHI in digital era --
Toshio Kobayashi (SIT)
(5) 13:35-14:10 [Invited Talk]
Electrical coupling of stacked transistors in monolithic three-dimensional inverters and its dependence on the interlayer dielectric thickness SDM2016-143
Junichi Hattori, Koichi Fukuda, Toshifumi Irisawa, Hiroyuki Ota, Tatsuro Maeda (AIST)
(6) 14:10-14:45 [Invited Talk]
Large Scale Crossbar Switch Block (CSB) with Via-Switch for a Low-Power FPGA SDM2016-144
Naoki Banno, Munehiro Tada, Koichiro Okamoto, Noriyuki Iguchi, Toshitsugu Sakamoto, Hiromitsu Hada (NEC Corp.), Hiroyuki Ochi (Ritsumeikan Univ.), Hidetoshi Onodera (Kyoto Univ.), Masanori Hashimoto (Osaka Univ.), Tadahiko Sugibayashi (NEC Corp.)
  14:45-15:00 Break ( 15 min. )
(7) 15:00-15:35 [Invited Talk]
Properties of amorphous Co alloys having liner/barrier function in advanced LSI interconnection
Maryamsadat Hosseini, Hiroyuki Koide, Kazuki Watanabe, Daisuke Ando, Yuji Sutou, Junichi Koike (Tohoku Univ.)
(8) 15:35-16:10 [Invited Talk]
Development of a Wet Cleaning Process for High-Yield Formation of via-last TSVs SDM2016-145
Naoya Watanabe (AIST), Hidekazu Kikuchi, Azusa Yanagisawa (LAPIS), Haruo Shimamoto, Katsuya Kikuchi, Masahiro Aoyagi (AIST), Akio Nakamura (LAPIS)
(9) 16:10-16:45 [Invited Talk]
Direct Cu metallization on TGV Glass substrate using Wet Process. SDM2016-146
Kotoku Inoue, Masatoshi Takayama, Tsubasa Fujimura, Shigeo Onitake (Koto)
  16:45-16:50 Closing ( 5 min. )

Announcement for Speakers
Invited TalkEach speech will have 25 minutes for presentation and 10 minutes for discussion.

Contact Address and Latest Schedule Information
SDM Technical Committee on Silicon Device and Materials (SDM)   [Latest Schedule]
Contact Address Rihito Kuroda(Tohoku Univ.)
Tel 022-795-4833 Fax 022-795-4834
E-: e3 

Last modified: 2017-01-17 14:50:15

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