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Technical Committee on Silicon Device and Materials (SDM) [schedule] [select]
Chair Yasuo Nara
Vice Chair Yuzou Oono (Univ. of Tsukuba)
Secretary Yoshitaka Sasago (Hitachi)
Assistant Rihito Kuroda (Tohoku Univ.)

Conference Date Fri, Feb 28, 2014 09:25 - 16:25
Conference Place  
Sponsors This conference is co-sponsored by The Japan Society of Applied Physics.
All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034)

Fri, Feb 28 AM 
09:25 - 16:25
  09:25-09:30 Opening Address ( 5 min. )
(1) 09:30-10:10 [Invited Talk]
Large-Radius Neutral Beam Enhanced Chemical Vapor Deposition Process for Non-Porous Ultra-low-k SiOCH SDM2013-165
Yoshiyuki Kikuchi (Tokyo Electron/Tohoku Univ.), Seiji Samukawa (Tohoku Univ.)
(2) 10:10-10:40 [Invited Talk]
Trend of practical technology in advanced low-k integration SDM2013-166
Naoya Inoue (Renesas Electronics Corp.)
  10:40-11:00 Break ( 20 min. )
(3) 11:00-11:30 [Invited Talk]
Impact of Back Grind Damage on Si Wafer Thinning for 3D Integration SDM2013-167
Yoriko Mizushima (Fujitsu Lab./Tokyo Inst. of Tech.), Youngsuk Kim (Tokyo Inst. of Tech./Disco), Tomoji Nakamura (Fujitsu Lab.), Ryuichi Sugie, Hideki Hashimoto (Toray Research Center), Akira Uedono (Univ. of Tsukuba), Takayuki Ohba (Tokyo Inst. of Tech.)
(4) 11:30-12:00 [Invited Talk]
Injection technique of organic-base conductive ink toward fast formation of TSV SDM2013-168
Jin Kawakita (National Institute for Materials Science)
  12:00-13:00 Lunch Break ( 60 min. )
(5) 13:00-13:50 [Keynote Address]
Integrated Circuits in Future
-- How do we find opportunity and challenge of integrated circuits? --
Kazuya Masu (Tokyo Inst. of Tech.)
(6) 13:50-14:20 [Invited Talk]
Novel Implantation Process of Carbon Nanotubes for Plugs and Vias, and their Integration with Transferred Multilayer Graphene Wire Obtained by Annealing Sputtered Amorphous Carbon SDM2013-170
Motonobu Sato, Makoto Takahashi, Mizuhisa Nihei, Shintaro Sato, Naoki Yokoyama (AIST)
  14:20-14:40 Break ( 20 min. )
(7) 14:40-15:20 [Invited Talk]
Low temperature growth of dense carbon nanotube arrays on conductive underlayers SDM2013-171
Suguru Noda (Waseda Univ.), Nuri Na (Waseda Univ./Univ. of Tokyo), Takashi Shirai, Keisuke Nomura (Univ. of Tokyo), Kei Hasegawa (Waseda Univ.)
(8) 15:20-15:50 [Invited Talk]
TSV Liner Formation with Vapor Deposited Polyimides SDM2013-172
Takafumi Fukushima, Mariappan Murugesan, Jicheol Bea, Kangwook Lee, Mitsumasa Koyanagi (Tohoku Univ.)
(9) 15:50-16:20 [Invited Talk]
15μm-pitch Bump Interconnections Relied on Flip-chip Bonding Technique
-- for Advanced Chip Stacking Applications --
Masahiro Aoyagi, Thanh-Tung Bui, Fumiki Kato, Naoya Watanabe, Shunsuke Nemoto, Katsuya Kikuchi (AIST)
  16:20-16:25 Closing Address ( 5 min. )

Announcement for Speakers
Keynote AddressEach speech will have 40 minutes for presentation and 10 minutes for discussion.
Invited TalkEach speech will have 30 minutes for presentation and 10 minutes for discussion.
Invited TalkEach speech will have 20 minutes for presentation and 10 minutes for discussion.

Contact Address and Latest Schedule Information
SDM Technical Committee on Silicon Device and Materials (SDM)   [Latest Schedule]
Contact Address Yukinori Ono(NTT)
Tel 046-240-2641 Fax 046-240-4317
E-: o 

Last modified: 2013-12-16 08:25:13

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