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Technical Committee on Silicon Device and Materials (SDM) (Searched in: 2019)
Search Results: Keywords 'from:2020-02-07 to:2020-02-07'
| Committee | Date Time | Place | Paper Title / Authors | Abstract | Paper # | |
| SDM | 2020-02-07 09:20 |
Tokyo | Tokyo University-Hongo | Formation of passivation layer on Cu and Co surfaces in BTA-H2O2 aqueous solutions Kondoh, Eiichi, Toyama, Mao, Takeuchi, Shota, Jin, Lianhua (Univ. Yamanashi), Ryota Koshino, Hamada, Satomi, Shima, Shohei, Hiyama, Hirokuni (Ebara Corp.)  SDM2019-88 |
[more] | SDM2019-88 pp.1-3 |
| SDM | 2020-02-07 09:35 |
Tokyo | Tokyo University-Hongo | [Invited Talk]
Impact of Homogeneously Dispersed Al Nanoclusters by Si-monolayer Insertion into Hf0.5Zr0.5O2 Film on FeFET Memory Array with Tight Threshold Voltage Distribution Tadashi Yamaguchi, Keiichi Maekawa, Takahiro Ohara, Atsushi Amo, Eiji Tsukuda, Kenichiro Sonoda, Hiroshi Yanagita, Masao Inoue, Masazumi Matsuura, Tomohiro Yamashita (Renesas) SDM2019-89 |
[more] | SDM2019-89 pp.5-8 |
| SDM | 2020-02-07 10:10 |
Tokyo | Tokyo University-Hongo | [Invited Talk]
Stability of Cu Interconnect Surface after post CMP Cleaning Yasuhiro Kawase, Toshiaki Shibata, Tomohiro Kusano (MCC), Ken Harada (imec), Kan Takeshita (MCC) SDM2019-90 |
At present, more than 12 Cu interconnect layers have been formed in advanced semiconductor devices and each layer is pla... [more] | SDM2019-90 pp.9-14 |
| SDM | 2020-02-07 10:45 |
Tokyo | Tokyo University-Hongo | [Invited Talk]
Role of electroless-Ni plating in high-aspect-ratio TSV fabrication for 3D integration and packaging Murugesan Mariappan, Takafumi Fukushima (Tohoku Univ.) SDM2019-91 |
[more] | SDM2019-91 pp.15-19 |
| SDM | 2020-02-07 11:20 |
Tokyo | Tokyo University-Hongo | [Invited Talk]
Novel Volatile Film for Precise Dual Damascene Fabrication Makoto Fujikawa, Tatsuya Yamaguchi (TTS), Yuki Kikuchi, Kaoru Maekawa (TTCA), Hiroaki Kawasaki, Yoji Iizuka (TEL) SDM2019-92 |
Abstract— Plasma induced damage on porous low-k dielectrics is a critical issue to lower the interconnect RC delay in th... [more] | SDM2019-92 pp.21-23 |
| SDM | 2020-02-07 13:30 |
Tokyo | Tokyo University-Hongo | [Special Invited Talk]
Possibility of intermetallic compounds for ultra-small scale interconnections Junichi Koike, Linghan Chen (Tohoku Univ), Shinji Yokogawa (Univ. Elec-Comm) SDM2019-93 |
[more] | SDM2019-93 p.25 |
| SDM | 2020-02-07 14:20 |
Tokyo | Tokyo University-Hongo | [Invited Talk]
Solution-processed interconnections using vacuum ultraviolet Takeo Minari, Wanli Li, Qingqing Sun, Lingying Li (NIMS), Xuying Liu (Zhengzhou Univ.), Masayuki Kanehara (C-INK) SDM2019-94 |
We propose new metallization methods based on "surface selective deposition" or "selective electroless plating". [more] | SDM2019-94 pp.27-30 |
| SDM | 2020-02-07 14:55 |
Tokyo | Tokyo University-Hongo | [Invited Talk]
A THIN BONDING MATERIAL FOR HIGH DENSITY HETEROGENEOUS INTEGRATION Yasuhisa Kayaba, Yuzo Nakamura, Jun Kamada, Takashi Kozeki, Kazuo Kohmura (MCI) SDM2019-95 |
A new thin bonding material was developed for the heterogeneous device chip integration by Cu-Cu hybrid bonding. The bon... [more] | SDM2019-95 pp.31-34 |
| SDM | 2020-02-07 15:50 |
Tokyo | Tokyo University-Hongo | [Invited Talk]
Thermal Boundary Resistance of Metal/Dielectric Interfaces in Silicon Nanowire Thermoelectric Generators Tianzhuo Zhan (Waseda Univ.) SDM2019-96 |
[more] | SDM2019-96 pp.35-38 |
| SDM | 2020-02-07 16:25 |
Tokyo | Tokyo University-Hongo | [Invited Talk]
Nanophotonics contributions to state-of-the-art CMOS Image Sensors Sozo Yokogawa (SSS) SDM2019-97 |
Recent progress of Back-illuminated CMOS image sensor (BI-CIS), focusing on their pixel improvements with design of opti... [more] | SDM2019-97 pp.39-43 |
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