Committee |
Date Time |
Place |
Paper Title / Authors |
Abstract |
Paper # |
ICD, CPM |
2007-01-18 09:00 |
Tokyo |
Kika-Shinko-Kaikan Bldg. |
On-Die Monitoring of Substrate Coupling for Mixed-Signal Circuit Isolation Takumi Danjo, Daisuke Kosaka, Makoto Nagata (Kobe Univ.) |
[more] |
CPM2006-129 ICD2006-171 pp.1-5 |
ICD, CPM |
2007-01-18 09:25 |
Tokyo |
Kika-Shinko-Kaikan Bldg. |
Study on Active Substrate Noise Cancelling Technique using Power Line di/dt Detector Taisuke Kazama (Univ. of Tokyo), Makoto Ikeda, Kunihiro Asada (VDEC) |
[more] |
CPM2006-130 ICD2006-172 pp.7-12 |
ICD, CPM |
2007-01-18 09:50 |
Tokyo |
Kika-Shinko-Kaikan Bldg. |
Measurement of Delay Variation Due to Inductive Coupling Noise in 90nm Global Interconnects Yasuhiro Ogasahara, Masanori Hashimoto, Takao Onoye (Osaka Univ.) |
Inductive coupling is becoming a design concern for global interconnects in nano-meter technologies. This paper shows me... [more] |
CPM2006-131 ICD2006-173 pp.13-18 |
ICD, CPM |
2007-01-18 10:15 |
Tokyo |
Kika-Shinko-Kaikan Bldg. |
Measurement of Delay Degradation Due to Power Supply Noise and Delay Variation Estimation with Full-Chip Simulation Yasuhiro Ogasahara, Takashi Enami, Masanori Hashimoto (Osaka Univ.), Takashi Sato (Tokyo Inst. Tech.), Takao Onoye (Osaka Univ.) |
Power integrity is an crucial design issue in nano-meter technologies because of lowered supply voltage and current incr... [more] |
CPM2006-132 ICD2006-174 pp.19-23 |
ICD, CPM |
2007-01-18 10:55 |
Tokyo |
Kika-Shinko-Kaikan Bldg. |
Delay Variation Analysis in Consideration of Dynamic Power Supply Noise Waveform Mitsuya Fukazawa, Makoto Nagata (Kobe Univ.) |
Delay variability due to dynamic power supply noise is elucidated by on-chip signal waveform measurements at 100-ps/100-... [more] |
CPM2006-133 ICD2006-175 pp.25-29 |
ICD, CPM |
2007-01-18 11:20 |
Tokyo |
Kika-Shinko-Kaikan Bldg. |
[Special Invited Talk]
Proximity Inter-chip Communications Tadahiro Kuroda, Kiichi Niitsu (Keio Univ.) |
[more] |
CPM2006-134 ICD2006-176 pp.31-35 |
ICD, CPM |
2007-01-18 13:00 |
Tokyo |
Kika-Shinko-Kaikan Bldg. |
[Invited Talk]
Fine electronic cuircuit pattern formation by various metal nanoparticle pastes
-- Approach by the design of metal nanoparticles -- Masami Nakamoto (Osaka Munic. Tech. Res. Inst.) |
[more] |
CPM2006-135 ICD2006-177 pp.37-42 |
ICD, CPM |
2007-01-18 13:50 |
Tokyo |
Kika-Shinko-Kaikan Bldg. |
“In Situ” Evaluation for On-Chip Inductors Using Impedance Balance Method Mizuki Motoyoshi, Minoru Fujishima (The Univ. of Tokyo) |
[more] |
CPM2006-136 ICD2006-178 pp.43-48 |
ICD, CPM |
2007-01-18 14:15 |
Tokyo |
Kika-Shinko-Kaikan Bldg. |
Design of Wideband tuning VCO for TV Receiver System Takatsugu Kamata, Toshimasa Matsuoka, Kenji Taniguchi (Osaka Univ.) |
[more] |
CPM2006-137 ICD2006-179 pp.49-54 |
ICD, CPM |
2007-01-18 14:40 |
Tokyo |
Kika-Shinko-Kaikan Bldg. |
An Integrated 20-26 GHz CMOS Up-Conversion Mixer with Low Power Consumption Yuki Kambayashi, Ivan Chee Hong Lai, Minoru Fujishima (U.T.) |
A fully integrated 20-26 GHz broadband up-conversion mixer with low power consumption is demonstrated on 90nm CMOS techn... [more] |
CPM2006-138 ICD2006-180 pp.55-60 |
ICD, CPM |
2007-01-18 15:20 |
Tokyo |
Kika-Shinko-Kaikan Bldg. |
[Special Invited Talk]
3-Dimensional Packaging Technology and Super-Chip Integration Tetsu Tanaka, Takafumi Fukushima, Mitsumasa Koyanagi (Tohoku Univ.) |
[more] |
CPM2006-139 ICD2006-181 pp.61-65 |
ICD, CPM |
2007-01-18 16:35 |
Tokyo |
Kika-Shinko-Kaikan Bldg. |
Local deformation and residual stress of thin chips stacked by flip chip structures Hideo Miura, Nobuki Ueta, Yuki Sato (Tohoku Univ.) |
[more] |
CPM2006-140 ICD2006-182 pp.67-72 |
ICD, CPM |
2007-01-19 09:00 |
Tokyo |
Kika-Shinko-Kaikan Bldg. |
Development of Packages for Ultra-violet Light-Emitting Diodes
-- Approach to high-light-extraction efficiency by Flip-Chip packages -- Iwao Mitsuishi, Shinya Nunoue, Hiroshi Yamada, Shinya Nunoue (Toshiba) |
[more] |
CPM2006-141 ICD2006-183 pp.73-76 |
ICD, CPM |
2007-01-19 09:25 |
Tokyo |
Kika-Shinko-Kaikan Bldg. |
Ultra-Fine Pitch Cu Bumpless Interconnect for High Density System Integration Aktisu Shigetou, Toshihiro Itoh, Tadatomo Suga (Univ. of Tokyo) |
We report the studies on the ultra-fine pitch Cu bumpless interconnect relating to the direct bonding of CMP-Cu done by ... [more] |
CPM2006-142 ICD2006-184 pp.77-81 |
ICD, CPM |
2007-01-19 09:50 |
Tokyo |
Kika-Shinko-Kaikan Bldg. |
Modeling of Wire Bonding Process for High Performance Device Eiichi Yamada, Masazumi Amagai (TI Japan) |
[more] |
CPM2006-143 ICD2006-185 pp.83-86 |
ICD, CPM |
2007-01-19 10:15 |
Tokyo |
Kika-Shinko-Kaikan Bldg. |
Signal Transmission Guideline in IC Package Kentaro Takao, Chikara Azuma, Masazumi Amagai (TIJ) |
[more] |
CPM2006-144 ICD2006-186 pp.87-90 |
ICD, CPM |
2007-01-19 10:55 |
Tokyo |
Kika-Shinko-Kaikan Bldg. |
Failure analysis system to classify failure modes using combination of FBMs Hitoshi Maeda, Fumihito Ohta, Michio Kuniya, Koji Fukumoto (Renesas Technology) |
[more] |
CPM2006-145 ICD2006-187 pp.91-96 |
ICD, CPM |
2007-01-19 11:20 |
Tokyo |
Kika-Shinko-Kaikan Bldg. |
Improvement of layout analysis by connecting emission/OBIRCH analysis with CAD data Akira Shimase, Akihito Uchikado, Mitsuaki Saeki, Shinichi Watarai, Takeshi Suzuki, Toshiyuki Majima (Renesas), Kazuhiro Hotta, Hirotoshi Terada (HPK) |
[more] |
CPM2006-146 ICD2006-188 pp.97-102 |
ICD, CPM |
2007-01-19 11:45 |
Tokyo |
Kika-Shinko-Kaikan Bldg. |
SoC macro-block diagnosis using extracted layout information Katsuyoshi Miura, Koji Nakamae (Osaka Univ.) |
A SoC macro-block diagnostic method using a netlist extracted from layout data is proposed. A hard IP core that does no... [more] |
CPM2006-147 ICD2006-189 pp.103-108 |
ICD, CPM |
2007-01-19 13:00 |
Tokyo |
Kika-Shinko-Kaikan Bldg. |
A Constrained Test Generation Method for Low Power Testing Yoshiaki Tounoue, Xiaoqing Wen, Seiji Kajihara (K I T), Kohei Miyase (JST), Tatsuya Suzuki, Yuta Yamato (K I T) |
High Power dissipation when the response to a test vector is captured by flip-flops in scan testing which may cause exce... [more] |
CPM2006-148 ICD2006-190 pp.109-114 |