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Technical Committee on Silicon Device and Materials (SDM)
Chair: Takahiro Shinada (Tohoku Univ.) Vice Chair: Hiroshige Hirano (TowerJazz Panasonic)
Secretary: Hiroya Ikeda (Shizuoka Univ.), Tetsu Morooka (KIOXIA)
Assistant: Takahiro Mori (AIST), Nobuaki Kobayashi (Nihon Univ.)

DATE:
Fri, Feb 7, 2020 09:15 - 17:05

PLACE:

TOPICS:

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Fri, Feb 7 AM (09:15 - 17:05)
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----- Opening ( 5 min. ) -----

(1) 09:20 - 09:35
Formation of passivation layer on Cu and Co surfaces in BTA-H2O2 aqueous solutions
Kondoh, Eiichi, Toyama, Mao, Takeuchi, Shota, Jin, Lianhua (Univ. Yamanashi), Ryota Koshino, Hamada, Satomi, Shima, Shohei, Hiyama, Hirokuni (Ebara Corp.)

(2) 09:35 - 10:10
[Invited Talk]
Impact of Homogeneously Dispersed Al Nanoclusters by Si-monolayer Insertion into Hf0.5Zr0.5O2 Film on FeFET Memory Array with Tight Threshold Voltage Distribution
Tadashi Yamaguchi, Keiichi Maekawa, Takahiro Ohara, Atsushi Amo, Eiji Tsukuda, Kenichiro Sonoda, Hiroshi Yanagita, Masao Inoue, Masazumi Matsuura, Tomohiro Yamashita (Renesas)

(3) 10:10 - 10:45
[Invited Talk]
Stability of Cu Interconnect Surface after post CMP Cleaning
Yasuhiro Kawase, Toshiaki Shibata, Tomohiro Kusano (MCC), Ken Harada (imec), Kan Takeshita (MCC)

(4) 10:45 - 11:20
[Invited Talk]
Role of electroless-Ni plating in high-aspect-ratio TSV fabrication for 3D integration and packaging
Murugesan Mariappan, Takafumi Fukushima (Tohoku Univ.)

(5) 11:20 - 11:55
[Invited Talk]
Novel Volatile Film for Precise Dual Damascene Fabrication
Makoto Fujikawa, Tatsuya Yamaguchi (TTS), Yuki Kikuchi, Kaoru Maekawa (TTCA), Hiroaki Kawasaki, Yoji Iizuka (TEL)

----- Lunch Break ( 95 min. ) -----

(6) 13:30 - 14:20
[Special Invited Talk]
Possibility of intermetallic compounds for ultra-small scale interconnections
Junichi Koike, Linghan Chen (Tohoku Univ), Shinji Yokogawa (Univ. Elec-Comm)

(7) 14:20 - 14:55
[Invited Talk]
Solution-processed interconnections using vacuum ultraviolet
Takeo Minari, Wanli Li, Qingqing Sun, Lingying Li (NIMS), Xuying Liu (Zhengzhou Univ.), Masayuki Kanehara (C-INK)

(8) 14:55 - 15:30
[Invited Talk]
A THIN BONDING MATERIAL FOR HIGH DENSITY HETEROGENEOUS INTEGRATION
Yasuhisa Kayaba, Yuzo Nakamura, Jun Kamada, Takashi Kozeki, Kazuo Kohmura (MCI)

----- Break ( 20 min. ) -----

(9) 15:50 - 16:25
[Invited Talk]
Thermal Boundary Resistance of Metal/Dielectric Interfaces in Silicon Nanowire Thermoelectric Generators
Tianzhuo Zhan (Waseda Univ.)

(10) 16:25 - 17:00
[Invited Talk]
Nanophotonics contributions to state-of-the-art CMOS Image Sensors
Sozo Yokogawa (SSS)

----- Closing ( 5 min. ) -----

# Information for speakers
General Talk will have 15 minutes for presentation.
Invited Talk will have 30 minutes for presentation and 5 minutes for discussion.
Special Invited Talk will have 45 minutes for presentation and 5 minutes for discussion.

# CONFERENCE SPONSORS:
- This conference is co-sponsored by The Japan Society of Applied Physics.

=== Technical Committee on Silicon Device and Materials (SDM) ===
# FUTURE SCHEDULE:

Mon, Apr 13, 2020 - Tue, Apr 14, 2020: Okinawaken Seinen Kaikan [Wed, Feb 12], Topics: Thin film devices (Si, compound, organic, flexible), Biotechnology, Materials, Characterization, etc.
Fri, May 29, 2020: Nagoya Institute of Technology [Fri, Mar 13]

# SECRETARY:
Tetsu Morooka(KIOXIA Corp.)
Tel 059-390-7451 Fax 059-361-2739
E-mail: