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=============================================== Technical Committee on Component Parts and Materials (CPM) Chair: Kiyoshi Ishii Vice Chair: Kiichi Kamimura Secretary: Yoshitaka Kitamoto, Toru Matsuura Assistant: Hidehiko Shimizu =============================================== Technical Committee on Integrated Circuits and Devices (ICD) Chair: Masao Nakaya Vice Chair: Akira Matsuzawa Secretary: Shinji Miyano, Koji Kai Assistant: Yoshiharu Aimoto, Makoto Nagata DATE: Thu, Sep 8, 2005 09:00 - 16:10 Fri, Sep 9, 2005 09:00 - 17:00 PLACE: TOPICS: ---------------------------------------- Thu, Sep 8 AM (09:00 - 10:15) ---------------------------------------- (1) 09:00 - 09:25 The comparison of electrical characteristics of FCBGA packaging substrate based on MLTS and conventional build-up PWB Jun Sakai, Koichiro Nakase (NEC), Hirokazu Honda (NECエレクトロニクス), Hirobumi Inoue (NEC) (2) 09:25 - 09:50 Characteristic dielectric constant for polyimide thin films at 10GHz Shigemasa Segawa (PI R&D), Sachiko Ito, Katsuya Kikuchi, Kazuhiko Tokoro, Hiroshi Nakagawa, Masahiro Aoyagi (AIST) (3) 09:50 - 10:15 Development of Design Techniques for Semiconductor-Package By using Simplified DRAM Macro Model of Power System Satoshi Nakamura, Takashi Suga (Hitachi PERL), Mitsuaki Katagiri, Yoji Nishio, Seiji Funaba, Yukitoshi Hirose, イサ サトシ (Elpida) ----- Break ( 15 min. ) ----- ---------------------------------------- Thu, Sep 8 AM (10:30 - 11:45) ---------------------------------------- (4) 10:30 - 10:55 Performance evaluation of high-precision manipulator for probing on entire chip surface Akira Nakada, Keijiro Itakura, Hiroshi Kubota (Kumamoto Univ.) (5) 10:55 - 11:20 Visualization of High Frequency Electromagnetic Field over Fine Circuits by Magnetooptic/Electrooptic Probe Mizuki Iwanami, Shigeki Hoshino, Norio Masuda (NEC), Masato Kishi (Univ. of Tokyo), Masahiro Tsuchiya (NICT) (6) 11:20 - 11:45 Diagnostic Test Compaction for Combinational and Sequential Circuits Yoshinobu Higami (Ehime Univ.), Kewal K Saluja (Univ. of Wisconsin), Hiroshi Takahashi, Shin-ya Kobayashi, Yuzo Takamatsu (Ehime Univ.) ----- Lunch Break ( 75 min. ) ----- ---------------------------------------- Thu, Sep 8 PM (13:00 - 14:15) ---------------------------------------- (7) 13:00 - 13:25 System Packaging Issue and Solution of Renesas SiP Noriaki Sakamoto, Norihiko Sugita, Takafumi Kikuchi, Hideki Tanaka, Takashi Akazawa (ルネサステクノロジ) (8) 13:25 - 13:50 Basic Study of Proper Circuit Line Structure for Advanced System in Package Shouhei Yasuda (Melco Display Tech.), Yoshiharu Iwata, Ryohei Satoh (Osaka Univ.) (9) 13:50 - 14:15 The Study of Silicon Stress for Stacked Die Packages Kenji Abe, Eiichi Yamada, Yutaka Suzuki, Masazumi Amagai (TI Japan) ----- Break ( 15 min. ) ----- ---------------------------------------- Thu, Sep 8 PM (14:30 - 16:10) ---------------------------------------- (10) 14:30 - 14:55 The Study of Stress Sensor for Stacked Die Packages Yutaka Suzuki, Kenji Abe, Eiichi Yamada, , Masazumi Amagai (TI Japan) (11) 14:55 - 15:20 Design and fabrication of MOS devices patterning with LCD image projection Akira Nakada, Satoshi Wakimoto, Hiroshi Kubota (Kumamoto Univ.) (12) 15:20 - 15:45 2 GHz Linear Amplifier Module with Feedforward Linearizer Hiroyuki Kayano (Toshiba), Yuji Ohtsuka, Masao Suzuki, Masaya Ishiguro (TDMS), Tatsunori Hashimoto (Toshiba) (13) 15:45 - 16:10 A CMOS Impulse Radio Ultra-Wideband Transceiver for 1Mb/s Data Communications and ±2.5cm Range Findings Takahide Terada, Shingo Yoshizumi, Muhammad Muqsith, Yukitoshi Sanada, Tadahiro Kuroda (Keio Univ.) ---------------------------------------- Fri, Sep 9 AM (09:00 - 10:40) ---------------------------------------- (14) 09:00 - 09:50 [Invited Talk] The study of the high frequency electrical characteristics in high-speed digital device mounting Chihiro Ueda (AETJAPAN) (15) 09:50 - 10:15 Analysis of Transmission Characteristic of High-speed Differential Sgnal Bus Tsuyoshi Tokiwa, Toshio Sudo (Toshiba), Nobuhiro Tsuruta (Toshiba DME), Yoshihiro Nishida (Toshiba DM) (16) 10:15 - 10:40 Measuemnt and Discussion of Degradation of Pulse Feature according with Line Length Increase Koichi Yabuuchi (EMtech), Tamotsu Usami, Yutaka Akiyama, Kanji Otsuka (Meisei Univ.) ----- Break ( 15 min. ) ----- ---------------------------------------- Fri, Sep 9 AM (10:55 - 11:45) ---------------------------------------- (17) 10:55 - 11:20 Lead-free bumping and its process integrity for fine pitch interconnects Hirokazu Ezawa, Masaharu Seto, Kazuhito Higuchi (Toshiba) (18) 11:20 - 11:45 Development of New Surface Finish Technology for Package Substrates with Excellent Bondability Kiyotaka Tsukada (IBIDEN) ----- Lunch Break ( 75 min. ) ----- ---------------------------------------- Fri, Sep 9 PM (13:00 - 14:15) ---------------------------------------- (19) 13:00 - 13:25 Simultaneous switching noise(SSN) and EMI of a semiconductor package Takanobu Kushihira (MSC), Toshio Sudo (TSB) (20) 13:25 - 13:50 Study of 6Gbps Operation on 0.18um Node CMOS I/O Inverter with Transmission Structure in Signal and Power Distribution Lines Yutaka Akiyama (Meisei Univ.), Tsuneo Ito (Excel Service), Kyouji Ito (Renesas NJS), Kanji Otsuka (Meisei Univ.) (21) 13:50 - 14:15 Measurement of Inner-chip Variation and Signal Integrity By a 90-nm Large-scale TEG Masaharu Yamamoto (STARC), Yayoi Hayasi, Hitoshi Endo (Hitachi ULSI), Hiroo Masuda (STARC) ----- Break ( 15 min. ) ----- ---------------------------------------- Fri, Sep 9 PM (14:30 - 15:20) ---------------------------------------- (22) 14:30 - 15:20 [Invited Talk] On chip transmission line interconnect Kazuya Masu, Kenichi Okada, Hiroyuki Ito (Tokyo Institute of Technology) ----- Break ( 10 min. ) ----- ---------------------------------------- Fri, Sep 9 PM (15:30 - 17:00) ---------------------------------------- (23) 15:30 - 17:00 [Panel Discussion] # Information for speakers General Talk will have 20 minutes for presentation and 5 minutes for discussion. Invited Talk will have 40 minutes for presentation and 10 minutes for discussion. === Technical Committee on Component Parts and Materials (CPM) === # FUTURE SCHEDULE: Thu, Oct 13, 2005 - Sat, Oct 15, 2005: Ritsumeikan Univ. [Thu, Aug 11], Topics: Nitride Based Optical and Electronic Devices, Materials and Related Technologies Fri, Oct 21, 2005: Kikai-Shinko-Kaikan Bldg. [Fri, Aug 19], Topics: Optical Recording, etc. Fri, Nov 11, 2005 - Sat, Nov 12, 2005: [Fri, Sep 16] # SECRETARY: Yoshitaka Kitamoto (Tokyo Institute of Technology) TEL 045-924-5424, FAX 045-924-5433 E-mail:      iem    Tohru Matsuura（ATR） TEL 0774-95-1173, FAX 0774-95-1178 E-mail: h matr === Technical Committee on Integrated Circuits and Devices (ICD) === # FUTURE SCHEDULE: Thu, Oct 20, 2005 - Fri, Oct 21, 2005: Ichinobo, Sakunami-Spa [Thu, Aug 25], Topics: Processor, DSP, Image Engineering and etc. Wed, Nov 30, 2005 - Fri, Dec 2, 2005: Kitakyushu International Conference Center [Fri, Sep 16], Topics: Design/Verification/Test of VLSI systems, etc. Thu, Dec 15, 2005 - Fri, Dec 16, 2005: [Thu, Oct 27] Last modified: 2005-08-04 17:39:28 |
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