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Technical Committee on Component Parts and Materials (CPM) [schedule] [select]
Chair Kiyoshi Ishii
Vice Chair Kiichi Kamimura
Secretary Yoshitaka Kitamoto, Toru Matsuura
Assistant Hidehiko Shimizu

Technical Committee on Integrated Circuits and Devices (ICD) [schedule] [select]
Chair Masao Nakaya
Vice Chair Akira Matsuzawa
Secretary Shinji Miyano, Koji Kai
Assistant Yoshiharu Aimoto, Makoto Nagata

Conference Date Thu, Sep 8, 2005 09:00 - 16:10
Fri, Sep 9, 2005 09:00 - 17:00
Topics  
Conference Place  

Thu, Sep 8 AM 
09:00 - 10:15
(1) 09:00-09:25 The comparison of electrical characteristics of FCBGA packaging substrate based on MLTS and conventional build-up PWB Jun Sakai, Koichiro Nakase (NEC), Hirokazu Honda (NECエレクトロニクス), Hirobumi Inoue (NEC)
(2) 09:25-09:50 Characteristic dielectric constant for polyimide thin films at 10GHz Shigemasa Segawa (PI R&D), Sachiko Ito, Katsuya Kikuchi, Kazuhiko Tokoro, Hiroshi Nakagawa, Masahiro Aoyagi (AIST)
(3) 09:50-10:15 Development of Design Techniques for Semiconductor-Package By using Simplified DRAM Macro Model of Power System Satoshi Nakamura, Takashi Suga (Hitachi PERL), Mitsuaki Katagiri, Yoji Nishio, Seiji Funaba, Yukitoshi Hirose, イサ サトシ (Elpida)
  10:15-10:30 Break ( 15 min. )
Thu, Sep 8 AM 
10:30 - 11:45
(4) 10:30-10:55 Performance evaluation of high-precision manipulator for probing on entire chip surface Akira Nakada, Keijiro Itakura, Hiroshi Kubota (Kumamoto Univ.)
(5) 10:55-11:20 Visualization of High Frequency Electromagnetic Field over Fine Circuits by Magnetooptic/Electrooptic Probe Mizuki Iwanami, Shigeki Hoshino, Norio Masuda (NEC), Masato Kishi (Univ. of Tokyo), Masahiro Tsuchiya (NICT)
(6) 11:20-11:45 Diagnostic Test Compaction for Combinational and Sequential Circuits Yoshinobu Higami (Ehime Univ.), Kewal K Saluja (Univ. of Wisconsin), Hiroshi Takahashi, Shin-ya Kobayashi, Yuzo Takamatsu (Ehime Univ.)
  11:45-13:00 Lunch Break ( 75 min. )
Thu, Sep 8 PM 
13:00 - 14:15
(7) 13:00-13:25 System Packaging Issue and Solution of Renesas SiP Noriaki Sakamoto, Norihiko Sugita, Takafumi Kikuchi, Hideki Tanaka, Takashi Akazawa (ルネサステクノロジ)
(8) 13:25-13:50 Basic Study of Proper Circuit Line Structure for Advanced System in Package Shouhei Yasuda (Melco Display Tech.), Yoshiharu Iwata, Ryohei Satoh (Osaka Univ.)
(9) 13:50-14:15 The Study of Silicon Stress for Stacked Die Packages Kenji Abe, Eiichi Yamada, Yutaka Suzuki, Masazumi Amagai (TI Japan)
  14:15-14:30 Break ( 15 min. )
Thu, Sep 8 PM 
14:30 - 16:10
(10) 14:30-14:55 The Study of Stress Sensor for Stacked Die Packages Yutaka Suzuki, Kenji Abe, Eiichi Yamada, , Masazumi Amagai (TI Japan)
(11) 14:55-15:20 Design and fabrication of MOS devices patterning with LCD image projection Akira Nakada, Satoshi Wakimoto, Hiroshi Kubota (Kumamoto Univ.)
(12) 15:20-15:45 2 GHz Linear Amplifier Module with Feedforward Linearizer Hiroyuki Kayano (Toshiba), Yuji Ohtsuka, Masao Suzuki, Masaya Ishiguro (TDMS), Tatsunori Hashimoto (Toshiba)
(13) 15:45-16:10 A CMOS Impulse Radio Ultra-Wideband Transceiver for 1Mb/s Data Communications and ±2.5cm Range Findings Takahide Terada, Shingo Yoshizumi, Muhammad Muqsith, Yukitoshi Sanada, Tadahiro Kuroda (Keio Univ.)
Fri, Sep 9 AM 
09:00 - 10:40
(14) 09:00-09:50 [Invited Talk]
The study of the high frequency electrical characteristics in high-speed digital device mounting
Chihiro Ueda (AETJAPAN)
(15) 09:50-10:15 Analysis of Transmission Characteristic of High-speed Differential Sgnal Bus Tsuyoshi Tokiwa, Toshio Sudo (Toshiba), Nobuhiro Tsuruta (Toshiba DME), Yoshihiro Nishida (Toshiba DM)
(16) 10:15-10:40 Measuemnt and Discussion of Degradation of Pulse Feature according with Line Length Increase Koichi Yabuuchi (EMtech), Tamotsu Usami, Yutaka Akiyama, Kanji Otsuka (Meisei Univ.)
  10:40-10:55 Break ( 15 min. )
Fri, Sep 9 AM 
10:55 - 11:45
(17) 10:55-11:20 Lead-free bumping and its process integrity for fine pitch interconnects Hirokazu Ezawa, Masaharu Seto, Kazuhito Higuchi (Toshiba)
(18) 11:20-11:45 Development of New Surface Finish Technology for Package Substrates with Excellent Bondability Kiyotaka Tsukada (IBIDEN)
  11:45-13:00 Lunch Break ( 75 min. )
Fri, Sep 9 PM 
13:00 - 14:15
(19) 13:00-13:25 Simultaneous switching noise(SSN) and EMI of a semiconductor package Takanobu Kushihira (MSC), Toshio Sudo (TSB)
(20) 13:25-13:50 Study of 6Gbps Operation on 0.18um Node CMOS I/O Inverter with Transmission Structure in Signal and Power Distribution Lines Yutaka Akiyama (Meisei Univ.), Tsuneo Ito (Excel Service), Kyouji Ito (Renesas NJS), Kanji Otsuka (Meisei Univ.)
(21) 13:50-14:15 Measurement of Inner-chip Variation and Signal Integrity By a 90-nm Large-scale TEG Masaharu Yamamoto (STARC), Yayoi Hayasi, Hitoshi Endo (Hitachi ULSI), Hiroo Masuda (STARC)
  14:15-14:30 Break ( 15 min. )
Fri, Sep 9 PM 
14:30 - 15:20
(22) 14:30-15:20 [Invited Talk]
On chip transmission line interconnect
Kazuya Masu, Kenichi Okada, Hiroyuki Ito (Tokyo Institute of Technology)
  15:20-15:30 Break ( 10 min. )
Fri, Sep 9 PM 
15:30 - 17:00
(23) 15:30-17:00 [Panel Discussion]

Announcement for Speakers
General TalkEach speech will have 20 minutes for presentation and 5 minutes for discussion.
Invited TalkEach speech will have 40 minutes for presentation and 10 minutes for discussion.

Contact Address and Latest Schedule Information
CPM Technical Committee on Component Parts and Materials (CPM)   [Latest Schedule]
Contact Address Yoshitaka Kitamoto (Tokyo Institute of Technology)
TEL 045-924-5424, FAX 045-924-5433
E-: iem

Tohru Matsuura(ATR)
TEL 0774-95-1173, FAX 0774-95-1178
E-: hmatr 
ICD Technical Committee on Integrated Circuits and Devices (ICD)   [Latest Schedule]
Contact Address  


Last modified: 2005-08-04 17:39:28


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