IEICE Technical Committee Submission System
Advance Program
Online Proceedings
[Sign in]
Tech. Rep. Archives
 Go Top  Go Back   Prev EMD Conf / Next EMD Conf [HTML] / [HTML(simple)] / [TEXT]  [Japanese] / [English] 

===============================================
Technical Committee on Electromechanical Devices (EMD)
Chair: Hideaki Sone (Tohoku Univ.)
Vice Chair: Makoto Hasegawa (Chitose Inst. of Science and Tech.), Ryo Nagase (NTT)
Secretary: Kiyoshi Yoshida (Nippon Inst. of Tech.), Toru Kawai (JAE)
Assistant: Junya Sekikawa (Shizuoka Univ.)

DATE:
Fri, Dec 21, 2007 13:00 - 17:15

PLACE:
Japan Aviation Electronics Industry,Limited(1-1, MUSASHINO 3-CHOME AKISHIMA-SHI TOKYO 196-8555 JAPAN. 042-549-9262)

TOPICS:


----------------------------------------
Fri, Dec 21 PM (13:00 - 17:15)
----------------------------------------

----- Opening Address ( 5 min. ) -----

(1) 13:05 - 13:30
A Study on Heat Analysis for Breaking Contact with Low Velocity (Part 3)
-- Influence of Holder Structure on Temperature Rise of Electrode (Part 3) --
Kazuaki Miyanaga, Yoshiki Kayano (Akita Univ.), Tasuku Takagi (Em. Prof. Tohoku University), Hiroshi Inoue (Akita Univ.)

(2) 13:30 - 13:55
Study of contact trouble phenomenon with silicone
-- Examination of gas adsorption phenomenon and silicone modification --
Makito Morii (Omron)

(3) 13:55 - 14:20
Degradation phenomenon of electrical contacts by hammering oscillating mechanism
-- The variation of contact resistance --
Shin-ichi Wada, Taketo Sonoda, Hiroshi Amao, Keiji Koshida, Yasuo Takahashi, Mitsuo Kikuchi, Hiroaki Kubota (TMC), Koichiro Sawa, Kei Koga, Ryo Nishioka (Keio Univ.)

----- Break ( 10 min. ) -----

(4) 14:30 - 14:55
Fabrication of room-temperature hydrogen gas sensors by the photochemical deposition method
Tetsuya Sueyoshi, Junji Inami, Masaya Ichimura (Nagoya Inst. of Tech.)

(5) 14:55 - 15:20
Optical devices besed on Siliconphotonics
Seiichi Itabashi, Hiroshi Fukuda, Tai Tsuchizawa, Toshifumi Watanabe, Koji Yamada (NTT)

(6) 15:20 - 15:45
PMT connector for polymer waveguides
Makoto Hikita, Yutaka Hatakeyama, Ayako Kudo, Hideyuki Takahara (NTT-AT)

----- Break ( 10 min. ) -----

(7) 15:55 - 16:20
Magnetic Pressure Welding of Copper Foils on Flexible Printed Circuit Boards (2nd Report)
Tomokatsu Aizawa (Tokyo Metropolitan College), Kenichi Hanazaki (Yazaki Corporation), Keigo Okagawa (Tokyo Metropolitan College)

(8) 16:20 - 16:45
*
Seiichi Onoda, Keiichi Inoue, Yasutoshi Komatsu (Watanabe.Co.,Ltd.)

(9) 16:45 - 17:10
*
Kenji Hagiwara, Takashi Tokunaga, Mitsutoshi Satou, Shuichi Aihara, Norihiro Ando, Taku Tanaka (JAE)

----- Closing Address ( 5 min. ) -----



=== Technical Committee on Electromechanical Devices (EMD) ===
# FUTURE SCHEDULE:

Fri, Jan 25, 2008: Kikai-Shinko-Kaikan Bldg. [Mon, Nov 19]
Fri, Feb 15, 2008: [Mon, Dec 10]
Fri, Mar 7, 2008: [Fri, Jan 18]

# SECRETARY:
Toru Kawai(JAE)
TEL (042) 549-9262、FAX (042) 549-9583
E-mail: itjae
Kiyoshi Yoshida(NIT)
TEL (0480) 33-7668、FAX (0480) 33-7680
E-mail: t
Junya Sekikawa (Shizuoka Univ.)
TEL (053) 478-1618、FAX (053) 478-1618
E-mail: tjkipc

# ANNOUNCEMENT:
# Latest information will be presented on the homepage: http://www.ieice.org/es/emd/jpn/


Last modified: 2007-10-24 15:24:54


Notification: Mail addresses are partially hidden against SPAM.

[Download Paper's Information (in Japanese)] <-- Press download button after click here.
 
[Cover and Index of IEICE Technical Report by Issue]
 

[Presentation and Participation FAQ] (in Japanese)
 

[Return to EMD Schedule Page]   /  
 
 Go Top  Go Back   Prev EMD Conf / Next EMD Conf [HTML] / [HTML(simple)] / [TEXT]  [Japanese] / [English] 


[Return to Top Page]

[Return to IEICE Web Page]


The Institute of Electronics, Information and Communication Engineers (IEICE), Japan