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Technical Committee on Component Parts and Materials (CPM) [schedule] [select]
Chair Fumihiko Hirose (Yamagata Univ.)
Vice Chair Mayumi Takeyama (Kitami Inst. of Tech.)
Secretary Yuichi Nakamura (Toyohashi Univ. of Tech.), Yuichi Akage (NTT)
Assistant Yasuo Kimura (Tokyo Univ. of Tech.), Hideki Nakazawa (Hirosaki Univ.), Tomoaki Terasako (Ehime Univ.)

Conference Date Thu, Aug 9, 2018 14:30 - 16:45
Fri, Aug 10, 2018 09:30 - 11:45
Topics Component Parts and Materials, etc. 
Conference Place Room 405 General Education Building, Bunkyo-cho Campus, Hirosaki University 
Address 1 Bunkyo-cho, Hirosaki, Aomori 036-8560, Japan
Transportation Guide http://www.hirosaki-u.ac.jp/en/access/map/bunkyocho.html
Contact
Person
Hideki Nakazawa, Hirosaki University
+81-172-39-3557
Sponsors This conference is co-sponsored by Department of Electronics and Information Technology, Hirosaki University
Participation Fee This workshop will be held as the IEICE workshop in fully electronic publishing. Participant fee will be necessary except the speakers and participants other than the participants to workshop(s) in non-electronic publishing. See the participant fee page. We request the participant fee to participants who will attend the workshop(s) on CPM.

Thu, Aug 9 PM 
14:30 - 16:45
(1) 14:30-14:50 Effects of nitrogen doping on the properties of Si-doped DLC films Kazuki Nakamura, Haruka Oohashi (Hirosaki Univ.), Tai Yokoyama, Kei-ichiro Tajima, Norihumi Endo, Maki Suemitsu (Tohoku Univ.), Yoshiharu Enta, Yasuyuki Kobayashi, Yushi Suzuki, Hideki Nakazawa (Hirosaki Univ.)
(2) 14:50-15:10 Growth of graphene on SiC/AlN/Si(110) substrates Hideki Nakazawa, Syunki Narita, Yuki Nara, Yoshiharu Enta (Hirosaki Univ.)
(3) 15:10-15:30 Investigation of formation conditions of SiC buffer layers for SiC/SiC buffer layer/AlN/Si(110) multilayer structures Yuki Nara, Asahi Kudo, Hideki Nakazawa (Hirosaki Univ.)
  15:30-15:45 Break ( 15 min. )
(4) 15:45-16:05 Developement of production-scale atomic layer deposition and its application for anticorrosion coating Fumihiko Hirose (Yamagata)
(5) 16:05-16:25 Study on the formation mechanism of Bi-mediated Ge nanodots fabricated by vacuum evaporation Kazuto Tsushima, Kensuke Takita, Hideki Nakazawa (Hirosaki Univ.), Takehiko Tawara, Kouta Tateno, Guoqiang Zhang, Hideki Gotoh (NTT), Takayuki Ikeda, Seiichiro Mizuno (NTT-AT), Hiroshi Okamoto (Hirosaki Univ.)
(6) 16:25-16:45 Fabrication and properties of multiferroic composites for optical modulation Yuichi Nakamura, Naohide Kamada, Taichi Goto, Hironaga Uchida, Mitsuteru Inoue (Toyohashi Tech.)
Fri, Aug 10 AM 
09:30 - 11:45
(7) 09:30-09:50 Nitrogen doping to ZnO films using NO gas excited on heated Ir wire surface in a catalytic reaction-assisted chemical vapor deposition Yuuki Adachi, Ryuta Iba, Shotarou Ono (Nagaoka Univ. Technol.), Koichirou Ooishi, Hironori Katagiri (Nagaoka College), Kanji Yasui (Nagaoka Univ. Technol.)
(8) 09:50-10:10 Relationship between taste evaluation of Ezoshika meat and electrical measurement Mayumi B. Takeyama (Kitami Inst. & Technol.), Shinji Yokogawa (UEC), Masaru Sato, Takashi Yasui (Kitami Inst. & Technol.)
(9) 10:10-10:30 Characterization of ZrOxNy thin films deposited at low temperatures Masaru Sato, Hideki Kitada, Mayumi B. Takeyama (kitami inst. of tech.)
  10:30-10:45 Break ( 15 min. )
(10) 10:45-11:05 Evaluation of rear surface passivation layer deposited by wet process Ryosuke Watanabe (Hirosaki Univ.), Tsubasa Koyama, Yoji Saito (Seikei Univ.)
(11) 11:05-11:25 Reduction reaction of SiO2 layer on Si substrate by irradiation of electron beam Keisuke Fujimori, Yosuke Chida, Yusuke Masuda, Natsuki Ujiie, Yoshiharu Enta (Hirosaki Univ.)
(12) 11:25-11:45 Surface composition and chemical bond structure of Zr-based metallic glass Haruto Koriyama, Keisuke Fujimori, Yoshiharu Enta (Hirosaki Univ.), Nozomu Togashi (Adamant Namiki Precision Jewel)

Announcement for Speakers
General TalkEach speech will have 15 minutes for presentation and 5 minutes for discussion.

Contact Address and Latest Schedule Information
CPM Technical Committee on Component Parts and Materials (CPM)   [Latest Schedule]
Contact Address  


Last modified: 2018-06-16 10:40:47


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