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=============================================== Technical Committee on Reliability (R) Chair: Tetsushi Yuge (National Defense Academy) Vice Chair: Akira Asato (Fujitsu) Secretary: Nobuyuki Tamura (Hosei Univ.), Shigeto Hiraguri (RTRI) Assistant: Shinji Inoue (Kansai Univ.), Hiroyuki Okamura (Hiroshima Univ.) =============================================== Technical Committee on Electromechanical Devices (EMD) Chair: Yoshiteru Abe (NTT) Secretary: Yuichi Hayashi (NAIST), Masato Mizukami (Muroran Inst. of Tech.) Assistant: Yoshiki Kayano (Univ. of Electro-Comm.) DATE: Fri, Feb 16, 2018 13:30 - 15:25 PLACE: TOPICS: ---------------------------------------- Fri, Feb 16 PM (13:30 - 15:25) ---------------------------------------- (1) 13:30 - 13:55 Friction and Contact Resisatnce of Tin Plated Contacts with Lubricant Atsushi Shimizu, Yasushi Saitoh (AutoNetworks Tech.) (2) 13:55 - 14:20 Influence of Wear Load on Fretting Corrosion Behavior of Silver Plating Films on Copper Alloys Plates Song-zhu Kure-chu (Nagoya Inst. of Tech.), Nobuhiro Kawakami (Iwate Univ.), Yongda YE (Nagoya Inst. of Tech.), Hitoshi Yashiro (Iwate Univ.), Kingo Furukawa, Yasushi Saitoh (AutoNetworks Tech.), Tomoyuki Sakata (SWS) ----- Break ( 15 min. ) ----- (3) 14:35 - 15:00 Terminal Plating to Lower the Insertion Force of Multiway Connectors Akihiro Katoh (AutoNetworks Tech.), Hajime Watanabe (SWS), Yoshifumi Saka, Kingo Furukawa, Yasushi Saitoh (AutoNetworks Tech.), Tomoyuki Sakata (SWS) (4) 15:00 - 15:25 Simultaneous Observation of Break Arcs from Two Directions by High Speed Cameras when a 48VDC/270A resistive circuit is interrupted Ryuichi Takano, Junya Sekikawa (Shizuoka Univ.) # Information for speakers General Talk will have 20 minutes for presentation and 5 minutes for discussion. # CONFERENCE SPONSORS: - This conference is co-sponsored by Reliability Engineering Association of Japan, IEEE Electronics Packaging Society, IEEE Reliability Society Japan Chapter. === Technical Committee on Reliability (R) === # FUTURE SCHEDULE: Fri, May 25, 2018: Aichi Institute of Technology, Motoyama Campus [Sun, Mar 18], Topics: Software Reliability, Overall reliability engineering # SECRETARY: Hiroyuki Okamura (Hiroshima Univ.) E-mail:     l     -u === Technical Committee on Electromechanical Devices (EMD) === # FUTURE SCHEDULE: Fri, Mar 2, 2018: Nippon Institute of Technology [Fri, Jan 19] Thu, Mar 8, 2018: [Fri, Jan 19] Fri, May 18, 2018: Muroran Institute of Technology [Wed, Mar 14] # SECRETARY: Yoshiteru Abe(NTT) TEL +81-29-868-6129，FAX +81-29-868-6142 E-mail: abe       Yuichi Hayashi(NAIST) TEL +81-743-72-5390，FAX +81-743-72-5391 E-mail:  -i is istMasato Mizukami(Muroran Institute of Technology) TEL&FAX +81-143-46-5307 E-mail: m-    mmm n-itYoshiki Kayano(Univ. of Electro-Comm.) TEL&FAX +81-42-443-5233 E-mail: y    c# ANNOUNCEMENT: # Latest information will be presented on the homepage: http://www.ieice.org/es/emd/jpn/ Last modified: 2018-02-08 14:14:15 |
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