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| Chair |
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Kiyoshi Ishii |
| Vice Chair |
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Kiichi Kamimura |
| Secretary |
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Toru Matsuura, Seiji Toyoda |
| Assistant |
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Hidehiko Shimizu, Yasushi Takemura |
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| Chair |
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Masao Nakaya |
| Vice Chair |
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Akira Matsuzawa |
| Secretary |
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Koji Kai, Yoshiharu Aimoto |
| Assistant |
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Makoto Nagata, Minoru Fujishima |
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| Conference Date |
Thu, Jan 18, 2007 09:00 - 17:00
Fri, Jan 19, 2007 09:00 - 16:35 |
| Topics |
LSI system assembly and module/inteface technology, test, general |
| Conference Place |
|
Thu, Jan 18 AM
09:00 - 10:40 |
| (1) |
09:00-09:25 |
On-Die Monitoring of Substrate Coupling for Mixed-Signal Circuit Isolation |
Takumi Danjo, Daisuke Kosaka, Makoto Nagata (Kobe Univ.) |
| (2) |
09:25-09:50 |
Study on Active Substrate Noise Cancelling Technique using Power Line di/dt Detector |
Taisuke Kazama (Univ. of Tokyo), Makoto Ikeda, Kunihiro Asada (VDEC) |
| (3) |
09:50-10:15 |
Measurement of Delay Variation Due to Inductive Coupling Noise in 90nm Global Interconnects |
Yasuhiro Ogasahara, Masanori Hashimoto, Takao Onoye (Osaka Univ.) |
| (4) |
10:15-10:40 |
Measurement of Delay Degradation Due to Power Supply Noise and Delay Variation Estimation with Full-Chip Simulation |
Yasuhiro Ogasahara, Takashi Enami, Masanori Hashimoto (Osaka Univ.), Takashi Sato (Tokyo Inst. Tech.), Takao Onoye (Osaka Univ.) |
| |
10:40-10:55 |
Break ( 15 min. ) |
Thu, Jan 18 AM
10:55 - 12:10 |
| (5) |
10:55-11:20 |
Delay Variation Analysis in Consideration of Dynamic Power Supply Noise Waveform |
Mitsuya Fukazawa, Makoto Nagata (Kobe Univ.) |
| (6) |
11:20-12:10 |
[Special Invited Talk]
Proximity Inter-chip Communications |
Tadahiro Kuroda, Kiichi Niitsu (Keio Univ.) |
| |
12:10-13:00 |
Lunch Break ( 50 min. ) |
Thu, Jan 18 PM
13:00 - 15:05 |
| (7) |
13:00-13:50 |
[Invited Talk]
Fine electronic cuircuit pattern formation by various metal nanoparticle pastes
-- Approach by the design of metal nanoparticles -- |
Masami Nakamoto (Osaka Munic. Tech. Res. Inst.) |
| (8) |
13:50-14:15 |
“In Situ” Evaluation for On-Chip Inductors Using Impedance Balance Method |
Mizuki Motoyoshi, Minoru Fujishima (The Univ. of Tokyo) |
| (9) |
14:15-14:40 |
Design of Wideband tuning VCO for TV Receiver System |
Takatsugu Kamata, Toshimasa Matsuoka, Kenji Taniguchi (Osaka Univ.) |
| (10) |
14:40-15:05 |
An Integrated 20-26 GHz CMOS Up-Conversion Mixer with Low Power Consumption |
Yuki Kambayashi, Ivan Chee Hong Lai, Minoru Fujishima (U.T.) |
| |
15:05-15:20 |
Break ( 15 min. ) |
Thu, Jan 18 PM
15:20 - 17:00 |
| (11) |
15:20-16:10 |
[Special Invited Talk]
3-Dimensional Packaging Technology and Super-Chip Integration |
Tetsu Tanaka, Takafumi Fukushima, Mitsumasa Koyanagi (Tohoku Univ.) |
| |
16:10-16:35 |
Break(Presentation cancel) ( 25 min. ) |
| (12) |
16:35-17:00 |
Local deformation and residual stress of thin chips stacked by flip chip structures |
Hideo Miura, Nobuki Ueta, Yuki Sato (Tohoku Univ.) |
Fri, Jan 19 AM
09:00 - 10:40 |
| (13) |
09:00-09:25 |
Development of Packages for Ultra-violet Light-Emitting Diodes
-- Approach to high-light-extraction efficiency by Flip-Chip packages -- |
Iwao Mitsuishi, Shinya Nunoue, Hiroshi Yamada, Shinya Nunoue (Toshiba) |
| (14) |
09:25-09:50 |
Ultra-Fine Pitch Cu Bumpless Interconnect for High Density System Integration |
Aktisu Shigetou, Toshihiro Itoh, Tadatomo Suga (Univ. of Tokyo) |
| (15) |
09:50-10:15 |
Modeling of Wire Bonding Process for High Performance Device |
Eiichi Yamada, Masazumi Amagai (TI Japan) |
| (16) |
10:15-10:40 |
Signal Transmission Guideline in IC Package |
Kentaro Takao, Chikara Azuma, Masazumi Amagai (TIJ) |
| |
10:40-10:55 |
Break ( 15 min. ) |
Fri, Jan 19 AM
10:55 - 12:10 |
| (17) |
10:55-11:20 |
Failure analysis system to classify failure modes using combination of FBMs |
Hitoshi Maeda, Fumihito Ohta, Michio Kuniya, Koji Fukumoto (Renesas Technology) |
| (18) |
11:20-11:45 |
Improvement of layout analysis by connecting emission/OBIRCH analysis with CAD data |
Akira Shimase, Akihito Uchikado, Mitsuaki Saeki, Shinichi Watarai, Takeshi Suzuki, Toshiyuki Majima (Renesas), Kazuhiro Hotta, Hirotoshi Terada (HPK) |
| (19) |
11:45-12:10 |
SoC macro-block diagnosis using extracted layout information |
Katsuyoshi Miura, Koji Nakamae (Osaka Univ.) |
| |
12:10-13:00 |
Lunch Break ( 50 min. ) |
Fri, Jan 19 PM
13:00 - 14:15 |
| (20) |
13:00-13:25 |
A Constrained Test Generation Method for Low Power Testing |
Yoshiaki Tounoue, Xiaoqing Wen, Seiji Kajihara (K I T), Kohei Miyase (JST), Tatsuya Suzuki, Yuta Yamato (K I T) |
| (21) |
13:25-13:50 |
A Note on 100x Test Data Compression for Scan-Based BIST |
Masayuki Arai, Satoshi Fukumoto, Kazuhiko Iwasaki (Tokyo Metro. Univ.), Tatsuru Matsuo, Takahisa Hiraide (Fujitsu Lab.), Hideaki Konishi, Michiaki Emori, Takashi Aikyo (Fujitsu) |
| (22) |
13:50-14:15 |
Investigation on estimation methods of faulty parameters for analog circuits |
Norio Kuji (Hachinohe National C. T.) |
| |
14:15-14:30 |
Break ( 15 min. ) |
Fri, Jan 19 PM
14:30 - 16:35 |
| (23) |
14:30-15:20 |
[Special Invited Talk]
Integrated RF MEMS and Its Packaging Technology |
Kei Kuwabara, Norio Sato (NTT), Katsuyuki Machida (NTT-AT), Hiromu Ishii, Munenari Kawashima, Yo Yamaguchi, Kazuhiro Uehara (NTT) |
| (24) |
15:20-15:45 |
Effects of the Board Power/Ground Layer Configuration on Simultaneous Switching Noise（SSN）and EMI |
Takanobu Kushihira (MSC), Toshio Sudo (Toshiba) |
| (25) |
15:45-16:10 |
Wid eband Decoupling Properties by the Combination of Ultra-thin Insulator and EBG Structure |
Seiju Ichijo (Toshiba), Takanobu Kushihira (MSC), Toshio Sudo (Toshiba) |
| (26) |
16:10-16:35 |
EMI Reducing Techniques for Low Voltage Differential Signaling by applying a Vertically Differential Method and Data arrangement optimization |
Ayako Takagi, Masahiro Baba, Haruhiko Okumura (Toshiba Corp. R＆D Ctr.) |
| Announcement for Speakers |
| General Talk | Each speech will have 20 minutes for presentation and 5 minutes for discussion. |
| Invited Talk | Each speech will have 40 minutes for presentation and 10 minutes for discussion. |
| Contact Address and Latest Schedule Information |
| CPM |
Technical Committee on Component Parts and Materials (CPM) [Latest Schedule]
|
| Contact Address |
Tohru Matsuura (ATR)
TEL 0774-95-1173, FAX 0774-95-1178
E- :  h m atr 
Seiji Toyoda（NTT）
TEL 0422-59-7365, FAX 0422-59-5575
E-:    i   
Hidehiko Shimizu（Niigata University）
TEL 025-262-6811, FAX 025-262-6811
E-:    eng i  -u
Yasushi Takemura（Yokohama National University）
TEL 045-339-4151, FAX 045-339-4151
E-:    y
Hiroshi Yamada (Toshiba)
TEL 044-549-2141, FAX 045-520-1501
E-:     ba |
| ICD |
Technical Committee on Integrated Circuits and Devices (ICD) [Latest Schedule]
|
| Contact Address |
Makoto Nagata (Kobe University)
TEL 078-803-6569,FAX 078-803-6221
E-:   be-u
Toshimasa Matsuoka (Osaka University)
TEL 06-6879-7792,FAX 06-6879-7792
E-:be-u |
Last modified: 2007-02-26 21:57:43
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